Deadhesion method and mechanism for wafer processing

ABSTRACT

A method of manufacturing semiconductor devices using an improved planarization processes for the planarization of the surfaces of the wafer on which the semiconductor devices are formed. The improved planarization process includes the formation of a flat planar surface from a deformable coating on the surface of the wafer using a fixed flexible planar interface material contacting the deformable coating.

RELATED PATENT APPLICATIONS

This application is related to U.S. patent application Ser. No.08/862,752, filed May 23, 1997, entitled “Planarization Process forSemiconductor Substrates.”

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention relates to the manufacturing of semiconductordevices. More particularly, the present invention relates to an improvedmethod and mechanism using a flexible planar material interface forwafer processing for the planarization of surfaces in the manufacturingof a semiconductor.

2. State of the Art

Typically, integrated circuits are manufactured by the deposition oflayers of predetermined materials to form the desired circuit componentson a silicon wafer semiconductor substrate. As the layers are depositedon the substrate wafer to form the desired circuit component, theplanarity of each of the layers is an important consideration becausethe deposition of each layer produces a rough, or nonplanar, topographyinitially on the surface of the wafer substrate and, subsequently, onany previously deposited layer of material. Typically, photolithographicprocesses are used to form the desired circuit components on the wafersubstrate. When such photolithographic processes are pushed to theirtechnological limits of circuit formation, the surface on which theprocesses are used must be as planar as possible to ensure success incircuit formation. This results from the requirement that theelectromagnetic radiation used to create a mask, which is used in theformation of the circuits of the semiconductor devices in wafer form,must be accurately focused at a single level, resulting in the preciseimaging over the entire surface of the wafer. If the wafer surface isnot sufficiently planar, the resulting mask will be poorly definedcausing, in turn, a poorly defined circuit which may malfunction. Sinceseveral different masks are used to form the different layers ofcircuits of the semiconductor devices on the substrate wafer, anynon-planar areas of the wafer will be subsequently magnified in laterdeposited layers.

After layer formation on the wafer substrate, either a chemicaletch-back process of planarization, or a global press planarizationprocess typically followed by a chemical etch-bach process ofplanarization, or chemical mechanical planarization process may be usedto planarize the layers before the subsequent deposition of a layer ofmaterial thereover. In this manner, the surface irregularities of alayer may be minimized so that subsequent layers deposed thereon do notsubstantially reflect the irregularities of the underlying layer.

One type of chemical etch-back process of planarization, illustrated inEUROPEAN PATENT APPLICATION 0 683 511 A2, uses a coating technique inwhich an object having a flat surface is used to planarize a coatingmaterial applied to the wafer surface prior to a plasma reactive ionetching process being used to planarize the wafer surface. Often,however, the planarization surface will contain defects, such as pits orother surface irregularities. These may result from defects in the flatsurface used for planarizing or from foreign material adhering to theflat surface. The etching of such a wafer surface having irregularitieswill, at best, translate those undesirable irregularities to the etchedsurface. Further, since some etching processes may not be fullyanisotropic, etching such irregular surfaces may increase the size ofthe defects in the etched wafer surface.

One type of global press planarization process, illustrated in U.S. Pat.No. 5,434,107, subjects a wafer with features formed thereon having beencoated with an inter-level dielectric material to an elevatedtemperature while an elevated pressure is applied to the wafer using apress until the temperature and pressure conditions exceed the yieldstress of the upper film on the wafer so that the film will attempt tobe displaced into and fill both the microscopic and local depressions inthe wafer surface. It should be noted that the film is only deformedlocally on the wafer, not globally, during the application of elevatedtemperature and pressure since the object contacting the surface of thewafer will only contact the highest points or areas on the surface ofthe wafer to deform or displace such points or areas of materiallocally, not globally displace the material on the entire wafer surface.Other non-local depressions existing in the wafer are not affected bythe pressing as sufficient material is not displaced thereinto.Subsequently, the temperature and pressure are reduced so that the filmwill become firm again thereby leaving localized areas having apartially planar upper surface on portions of the wafer while otherportions of the wafer surface will remain non-planar.

In one instance, global planar surfaces are created on a semiconductorwafer using a press located in a chamber. Referring to drawing FIG. 1, aglobal planarization apparatus 100 is illustrated. The globalplanarization apparatus 100 serves to press the surface of asemiconductor wafer 120 having multiple layers including a deformableoutermost layer 122 against a fixed pressing surface 132. The surface ofthe deformable layer 122 will assume the shape and surfacecharacteristics of the pressing surface 132 under the application offorce to the wafer 120. The global planarization apparatus 100 includesa fully enclosed apparatus having a hollow cylindrical chamber body 112and having open top and bottom ends, 113 and 114 respectively, andinterior surface 116 and an evacuation port 111. A base plate 118 havingan inner surface 117 is attached to the bottom end 114 of chamber body112 by bolts 194. A press plate 130 is removably mounted to the top end113 of chamber body 112 with pressing surface 132 facing base plate 118.The interior surface 116 of chamber body 112, the pressing surface 132of press plate 130 and the inner surface 117 of base plate 118 define asealable chamber. Evacuation port 111 can be positioned through anysurface, such as through base plate 118, and not solely through chamberbody 112.

The press plate 130 has a pressing surface 132 with dimensions greaterthan that of wafer 120 and being thick enough to withstand appliedpressure. Press plate 130 is formed from non-adhering material capableof being highly polished so that pressing surface 132 will impart thedesired smooth and flat surface quality to the surface of the deformablelayer 122 on wafer 120. Preferably, the press plate is a disc-shapedquartz optical flat.

A rigid plate 150 having top and bottom surfaces 152 and 154,respectively, and lift pin penetrations 156 therethrough is disposedwithin chamber body 112 with the top surface 152 substantially parallelto and facing the pressing surface 132. The rigid plate 150 isconstructed of rigid material to transfer a load under an applied forcewith minimal deformation.

A uniform force is applied to the bottom surface 154 of rigid plate 150through the use of a bellows arrangement 140 and relatively pressurizedgas to drive rigid plate 150 toward pressing surface 132. Relativepressure can be achieved by supplying gas under pressure or, if thechamber body 112 is under vacuum, allowing atmospheric pressure intobellows 140 to drive the same. The bellows 140 is attached at one end tothe bottom surface 154 of rigid plate 150 and to the inner surface 117of base plate 118 with a bolted mounting plate 115 to form a pressurecontainment that is relatively pressurized through port 119 in baseplate 118. One or more brackets 142 are mounted to the inner surface 117of the base plate 118 to limit the motion toward base plate 118 of therigid plate 118 to limit the motion toward base plate 118 of the rigidplate 150, when bellows 140 is not relatively pressurized. Theapplication of force through the use of a relatively pressurized gasensures the uniform application of force to the bottom surface 154 ofrigid plate 150. The use of rigid plate 150 will serve to propagate theuniform pressure field with minimal distortion. Alternately, the bellows140 can be replaced by any suitable means for delivering a uniformforce, such as a hydraulic means.

A flexible pressing member 160 is provided having upper and lowersurfaces 162 and 164, respectively, which are substantially parallel tothe top surface 152 of rigid plate 150 and pressing surface 132. Liftpin penetrations 166 are provided through member 165. The flexiblemember 160 is positioned with its bottom surface 164 in contact with thetop surface 152 of rigid plate 150 and lift pin penetrations 66 alignedwith lift penetrations 156 in rigid plate 150. The upper surface 162 ofthe member 160 is formed from a material having a low viscosity thatwill deform under an applied force to close lift pin penetrations 166and uniformly distribute the applied force to the wafer, even when thetop surface 152, the upper surface 162 and/or the lower surface 164 isnot completely parallel to the pressing surface 132 or when thicknessvariations exist in the wafer 120, rigid plate 150 or member 160, aswell as any other source of non-uniform applied force.

Lift pins 170 are slidably disposable through lift pin penetrations, 156and 166, respectively, in the form of apertures, to contact the bottomsurface 126 of wafer 120 for lifting the wafer 120 off the top surface162 of member 160. Movement of the lift pins 170 is controlled by liftpin drive assembly 172, which is mounted on the inner surface 117 of thebase plate 118. The lift pin drive assembly provides control of the liftpins 170 through conventional means. Lift pins 170 and lift pin driveassembly 172 are preferably positioned outside the pressure boundarydefined by the bellows 140 to minimize the number of pressure boundarypenetrations. However, they can be located within the pressure boundary,if desired, in a suitable manner.

A multi-piece assembly consisting of lower lid 180, middle lid 182, toplid 184, gasket 186 and top clamp ring 188 are used to secure the pressplated 130 to the top end 113 of chamber body 112. The ring-shaped lowerlid 180 is mounted to the top end 113 of chamber body 112 and has aportion with an inner ring dimension smaller than press plate 130 sothat press plate 130 is seated on lower lid 180. Middle lid 82 and toplid 184 are ring-shaped members having an inner ring dimension greaterthan press plate 130 and are disposed around press plate 130. Middle lid182 is located between lower lid 180 and top lid 184. A gasket 186 andtop clamp ring 188 are members having an inner ring dimension less thanthat of press plate 130 and are seated on the surface of press plate 130external to the chamber. Bolts 194 secured press plate 130 to thechamber body 112.

Heating elements 190 and thermocouples 192 control the temperature ofthe wafer 120 having coating 122 thereon, member 160 and othercomponents of the global planarization apparatus 100 located withinchamber body 112.

In operation, the top clamping ring 188, gasket 186, upper lid 184, andmiddle lid 182 are removed from the body 112 and the press plate 130lifted from lower lid 180. The bellows 140 is deflated and rigid plate150 is seated on stand off brackets 142. The wafer 120 is placed on theflexible member 160 with the side of the wafer 120 opposite thedeformable layer 122 in contact with flexible member 160. The pressplate 130 is mounted on the lower lid 180 and the middle lid 182, upperlid 184 are installed and tightened using gasket 186 and top clamp ring188 sealing press plate 130 between top clamp 188 and lower lid 180. Thetemperature of member 160, press plate 130, wafer 120 having coating 122thereon, and rigid plate 150 are adjusted through the use of heatingelements 190 monitored by thermocouples 192 to vary the deformationcharacteristics of the layer 122 of wafer 120. Chamber body 112 isevacuated through port 119 to a desired pressure.

A pressure differential is established between the interior and exteriorof the bellows 140, whether by pressurizing or by venting when thechamber body 112 having been evacuated thereby drives rigid plate 150,member 160, and wafer 120 toward press plate 130 and brings deformablelayer 122 of wafer 120 into engagement with press surface 132 of pressplate 130. Upon engagement of wafer 120 with press plate 130, thecontinued application of force will deform the flexible member 160which, in turn, serves to close lift penetrations 166 and distribute theforce to ensure the wafer 120 experiences uniform pressure on itssurface 122. After the wafer 120 has been in engagement with pressingsurface 132 for sufficient time to cause its surface 122 to globallycorrespond to the pressing surface 132, the surface 122 is hardened orcured. The pressure is released from the bellows 140 thereby retractingwafer 120, member 160, and rigid plate 150 from the press plate 130. Thedownward movement of rigid plate 150 will be terminated by itsengagement with stand off offset brackets 142.

Once the rigid plate 150 is fully retracted, the vacuum is released inchamber body 112. Lift pins 170 are moved through lift penetrations 156in the rigid plate 150 and lift penetrations 166 in the member 160 tolift wafer 120 off the member 160. The top clamping ring 188, gasket186, upper lid 184, middle lid 182, and press plate 130 are removed andthe wafer 120 is removed off lift pins 170 for further processing.

Once the wafer is removed, it will be subjected to an etch to establishthe planar surface at the desired depth. A system used or depicted inFIG. 1 provides an optimal method of deforming a flowable, curablematerial to form a generally planarized surface. However, the method isstill subject to yielding a wafer surface with irregularities therein,and the need for the subsequent etch to define the desired surfaceheight will still result in undesirable transfer and possibleenlargement of any such surface irregularities.

Conventional chemical mechanical planarization processes are used toplanarize layers formed on wafer substrates in the manufacture ofintegrated circuit semiconductor devices. Typically, a chemicalmechanical planarization (CMP) process planarizes a non-planar irregularsurface of a wafer by pressing the wafer against a moving polishingsurface that is wetted with a chemically reactive, abrasive slurry. Theslurry is usually either basic or acidic and generally contains aluminaor silica abrasive particles. The polishing surface is usually a planarpad made of a relatively soft, porous material, such as a blownpolyurethane, mounted on a planar platen.

Referring to drawing FIG. 2, a conventional chemical mechanicalplanarization apparatus is schematically illustrated. A semiconductorwafer 112 is held by a wafer carrier 111. A soft, resilient pad 113 ispositioned between the wafer carrier 111 and the wafer 112. The wafer112 is held against the pad 113 by a partial vacuum. The wafer carrier111 is continuously rotated by a drive motor 114 and is also designedfor transverse movement as indicated by the arrows 115. The rotationaland transverse movement is intended to reduce variability in materialremoval rates over the surface of the wafer 112. The apparatus furthercomprises a rotating platen 116 on which is mounted a polishing pad 117.The platen 116 is relatively large in comparison to the wafer 112, sothat during the chemical mechanical planarization process, the wafer 112may be moved across the surface of the polishing pad 117 by the wafercarrier 111. A polishing slurry containing a chemically reactivesolution, in which abrasive particles are suspended, is deliveredthrough a supply tube 118 onto the surface of the polishing pad 117.

Referring to drawing FIG. 3, a typical polishing table is illustrated intop view. The surface of the polishing table 1 is precision machined tobe flat and may have a polishing pad affixed thereto. The surface of thetable rotates the polishing pad past one or more wafers 3 to bepolished. The wafer 3 is held by a wafer holder, as illustratedhereinbefore, which exerts vertical pressure on the wafer against thepolishing pad. The wafer holder may also rotate and/or orbit the waferon the table during wafer polishing.

Alternately, the table 1 may be stationary and serve as a supportingsurface for individual polishing platens 2, each having their ownindividual polishing pad. As illustrated in U.S. Pat. No. 5,232,875,each platen may have its own mechanism for rotating or orbiting theplaten 2. A wafer holder will bring a wafer in contact with the platen 2and an internal or external mechanism to the wafer holder may be used toalso rotate the wafer during the polishing operation. In a polishingtable having multiple individual platens, each platen must be precisionmachined.

The wafers 3 are typically stored and transported in wafer cassetteswhich hold multiple wafers. The wafers 3 or wafer holders aretransported between the wafer cassettes and the polishing table 1 usingthe wafer transport arm 4. The wafer transport arm 4 will transport thewafers 3 between the polishing table and the stations 5, which may bewafer cassette stations or wafer monitoring stations.

The polishing characteristics of the polishing pad will change duringuse as multiple wafers 3 are polished. The glazing or changing of thepolishing characteristics will effect the planarization of the surfaceof the wafers 3, if the pads are not periodically conditioned andunglazed. The pad conditioner 6 is used to periodically unglaze thesurface of the polishing pad. The pad conditioner 6 has a range ofmotion which allows it to come in contact with the individual pads andconduct the period unglazing and then to move to its rest position.

The pressure between the surface of the wafer to be polished and themoving polishing pad may be generated by either the force of gravityacting on the wafer and the wafer carrier or a mechanical force appliednormal to the wafer surface. The slurry may be delivered or injectedthrough the polishing pad onto its surface. The planar platens may bemoved in a plane parallel to the pad surface with either an orbital,fixed-direction vibratory, or random direction vibratory motion.

While a chemical mechanical planarization process is an effectiveprocess to planarize the surface of a wafer, variations in height on thesurface to be planarized by the chemical mechanical planarizationprocess, although minimized through the chemical mechanicalplanarization process, will often not be completely removed to yield anoptimally planar surface. As is well known in the art, the chemicalmechanical planarization process polishing pad will deform, or “dish,”into recesses between structures of the surface of the wafer. Thestructure spacing on the wafer which will yield this “dishing” isclearly a function of various factors, such as the pad composition, thepolishing pressure, etc. This pad “dishing” will clearly lead to lessthan optimal planarization of the surface of the wafer. Further, thesurface irregularities extending into or down to the wafer surface beingplanarized tend to collect slurry thereby causing such areas of thewafer to be subjected to the corrosive effects of the slurry longer thanother areas of the wafer surface which do not collect the slurry.

To help minimize polishing pad deformation (dishing) caused by surfaceirregularities formed by the integrated circuit components on the wafersurface, dummy structures have also been included on the wafer surfacein an attempt to provide a more uniform spacing of structures on thewafer surface. While the use of such dummy structures will often beuseful, the ultimate result is also highly dependent upon the laterchemical mechanical planarization process conditions.

Alternately, a dry isotropic etching process may be used to etch thesurface on a wafer for planarization to facilitate planarization of thewafer surface irregularities, rather than use a chemical mechanicalplanarization process.

Therefore, a need exists to reduce the surface irregularities on a waferbefore a planarization process, such as a chemical mechanicalplanarization process or a dry etching process, of the wafer surface tofacilitate planarization of the wafer surface irregularities by such aprocess.

SUMMARY OF THE INVENTION

The present invention relates to the manufacturing of semiconductordevices. More particularly, the present invention relates to an improvedmethod and mechanism using a flexible interface material for waferprocessing for the global planarization of surfaces in the manufacturingof semiconductor devices. The present invention comprises an improvedmethod and apparatus for the global planarization of a deformablesurface of a wafer using a flexible planar material interface prior tothe planarization of the wafer using either an etching planarizationmethod on the wafer or a chemical mechanical planarization method on thewafer.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a side view of a global planarization apparatus;

FIG. 2 is an illustration of a conventional rotational chemicalmechanical planarization apparatus;

FIG. 3 is an illustration of a top view of a polishing table of aconventional rotational chemical mechanical planarization apparatus;

FIG. 4 is a cross-sectional view of a portion of a wafer substratehaving electrical circuit components formed thereon on a coatingthereover;

FIG. 5 is a cross-sectional view of a portion of a wafer substratehaving electrical circuit components formed thereon, a coatingthereover, a deformable coating, and a portion of a flat pressing memberand flexible planar interface material used in the present invention;

FIG. 6 is a cross-sectional view of a portion of a wafer substratehaving electrical circuit components formed thereon, a coatingthereover, and a deformable coating after the deformation thereof by theflat pressing member and flexible planar interface material and processof the present invention;

FIG. 7 is a cross-sectional view of a portion of a wafer substratehaving electrical circuit components formed thereon and a coatingmaterial between the electrical circuit components after theplanarization thereof;

FIGS. 8A and 8B are a process flow description of the improved chemicalmechanical planarization process of the present invention as illustratedin FIG. 7; and

FIG. 9 is a quarter cross-sectional view of a first embodiment of apress lid assembly for a press of the present invention to be used inthe method of the present invention;

FIG. 10 is a quarter cross-sectional view of a second embodiment of apress lid assembly for a press of the present invention to be used inthe method of the present invention;

FIG. 11 is a perspective view of the middle lid for the press lidassembly illustrated in drawing FIG. 10;

FIG. 12 is a quarter cross-sectional view of a third embodiment of apress lid assembly for a press of the present invention to be used inthe method of the present invention;

FIG. 13 is a quarter cross-sectional view of a fourth embodiment of apress lid assembly for a press of the present invention to be used inthe method of the present invention; and

FIG. 14 is a cross-sectional view of the present invention installed ona chamber for planarizing a deformable surface on a wafer.

The present invention will be better understood when the drawings aretaken in conjunction with the description of the present inventionhereafter.

DESCRIPTION OF THE INVENTION

Referring to drawing FIG. 4, a portion of a wafer substrate 20 isillustrated having portions of electrical circuit components 22 formedthereon and a coating of material 24, typically a metallic material, asemiconductor material, or an insulating material 24, covering theelectrical circuit components 22 and portions of the wafer substrate 20located between the electrical circuit components 22. As illustrated,the portions of the electrical circuit components 22 are formed havingupper surfaces 26 thereon while the coating of insulating material 24 isformed having an irregular nonplanar surface 28 extending over thesurfaces 26 of the electrical circuit components 22. The insulatingcoating 24 typically comprises an insulating oxide or other dielectricmaterial and may include a plurality of layers of such insulating orother types of material, as desired. In this instance, for convenience,the insulating material 24 is illustrated covering the wafer substrate20 and the electrical circuit components 22 thereon regardless of thenumber of layers thereof.

It can be easily seen that if only portions of the surface 28 ofinsulating material 24 is removed for the formation of additionalelectrical circuit components, the nonplanar surface of the insulatingmaterial 24 would cause masking and etching problems as the masking ofthe insulating material 24 would not be uniform as well as the etchingthereof would not be uniform. Therefore, the surface 28 must be globallyplanarized to facilitate further electrical circuit component formation.

At this juncture, if a conventional chemical mechanical planarizationprocess is used on the wafer substrate 20, the surface of the wafer willbe subject to a reactive slurry and one or more polishing pads used inthe process in an attempt to form a planar surface on the insulatingmaterial 24 covering the electrical circuit components 22. Some of theproblems associated with such a conventional chemical mechanicalplanarization process are that the reactive slurry is unevenlydistributed about the wafer substrate 20 and the pad used in the processthat particulates removed from the substrate 20 and insulating material24 during the polishing process may become lodged in the polishing padforming a glaze thereon thereby affecting the rate of removal by the padand causing the polishing pad to unevenly remove material during theprocess, and that as the chemical mechanical planarization processbegins by polishing an irregular surface on the wafer such surfacecauses the deformation of the polishing pad (dishing) thereby furtherinducing irregularities not initially present in the surface beingpolished. The induced irregularities of the surface of the wafer duringthe chemical mechanical planarization of the wafer surface being causedby the dishing of the polishing pad from the force applied thereto andthe deformation of the pad by surface areas of the wafer. Therefore,before starting a chemical mechanical planarization process of thesurface of a wafer, it is desirable to have the surface to be planarizedas nearly planar as possible to help ensure the even removal of materialtherefrom and to help eliminate the deformation of the polishing pad(s)being used to thereby, in turn, help minimize any surface irregularitiesbeing introduced into the surface being planarized by such paddeformation.

Similarly, if a conventional dry etching planarization process in aconventional etcher is used on the wafer substrate 20, the surface ofthe wafer will be subject to a reactive process by the gases used in theetching process in an attempt to form a planar surface on the insulatingmaterial 24 covering the electrical circuit components 22. Some of theproblems associated with such a conventional dry etching planarizationprocess are that if the surface 28 of the insulation material 24 is notplanar and is deformed, the isotropic etching of the layer 24 willresult in a non-planar surface, that the reactive gases may be unevenlydistributed about the wafer substrate 20 thereby further causing unevenetching of the surface 28 of the insulating material 24 on the substrate20 resulting in an increased non-planar surface 28, and that anyirregularities in the surface of the substrate 20 will be etched atdifferent rates by the gases used in the dry etching planarizationprocess causing the same or greater irregularities in the surface of thesubstrate 20. Simply stated, if the surface 28 of the insulatingmaterial 24 is non-planar or bumpy, the isotropic etching thereof willresult in a non-planar or bumpy surface 28.

Referring to drawing FIG. 5, the improved planarization process ofpresent invention is illustrated in relation to a wafer substrate 20having electrical circuit components 22 thereon and a coating ofinsulating material 24 thereover. In the improved planarization processof the present invention, prior to the initiation of the planarizationof the substrate 20, electrical circuit components 22 and insulatingmaterial 24, a layer of deformable material 30 is coated or depositedover the insulating material 24. The deformable material 30 may be ofany suitable type material that readily flows over the surface 28 of theinsulating material 24 and that is subsequently solidified throughcuring or hardening or other type of solidification. Alternately, thedeformable material 30, in some instances, may be a readily deformablemetal capable of being deformed under low temperature and low pressurewhich may be readily deposited over the coating 24 through well knowntechniques and processes. Whatever the type of deformable material 30,the deformable material 30 is applied over the insulating material 24 toany desired depth but is typically applied in a thickness greater thanthe thickness of the surface typography of the wafer. The thickness ofthe deformable material 30 initially applied to the wafer depending uponthe type of material selected for such use, the dimensions of thesurface irregularities, etc. After the application of the layer ofdeformable material 30 to the insulating material 24 and before thematerial 30 has cured, hardened, or solidified to the point which it isnot capable of being deformed, an object 32 having a flat planar surface34 thereon and a flexible planar material interface 40, which is fixedor immovable with respect to the substrate 20, are forced under pressureinto the deformable material 30 to form a flat, planar surface 36thereon and is kept in contact with the deformable material 30 while thedeformable material 30 cures, hardens, or solidifies. The object 32 maybe of any well known suitable material, such as an optical grade oroptical quality quartz disc-shaped object or glass disc-shaped object orceramic disc-shaped object or stone disc-shaped object or any desiredmaterial disc-shaped object, having a desired flat, planar surfacethereon which may be used to be pressed into the deformable material 30to form a flat, planar surface 36 thereon. If desired, the object 32 maybe tailored to meet process requirements of the desired range ofpressure to be applied to the deformable material 30 and the method ofcuring, hardening or solidifying the material 30. Further, if desired,the surface 34 on the object 32 may have a shape other than a flat,planar surface 34, such as either a concave surface, convex surface,concave and convex surface, or any type desired surface suitable in achemical mechanical planarization process. Additionally, the surface 34of the object 32 may be coated with a suitable release agent coating tofacilitate its removal from the flexible planar material interface 40after the after the curing, hardening or solidification of the coatingmaterial 30. The flexible planar material interface 40 may be anysuitable material, such as planar Teflon™ sheet material or the likehaving a high degree of planarity between the upper and lower surfacesthereof. Alternately, the flexible planar material interface 40 maycomprise a flexible planar sheet of metal, a flexible planar sheet ofpolymeric material, etc. The flexible planar interface material 40 mayeither allow the transmission of a broad spectrum of light therethroughor be opaque to a broad spectrum of light. If the flexible planarinterface material is of Teflon™, it is preferable that the flexibleplanar interface material 40 have a thickness in the range of 0.010inches to 0.040 inches. It is further preferable that the thickness ofthe Teflon™ flexible planar interface material 40 be approximately 0.010inches. The flexible planar material interface 40 is used to facilitatethe release of the object 32 from the surface 36 of the coating material30 after the curing, hardening or solidification thereof. If desired,the flexible planar material interface 40 may also be coated with asuitable release agent coating to facilitate its removal from thecoating material 30 after the curing, hardening, or solidificationthereof and/or to facilitate its removal from the object 32. Thesubstrate 20 is preferably removed from the flexible planar materialinterface 40 by applying fluid under pressure, preferably a burst offluid under pressure, between the object 32 and the flexible planarmaterial interface 40 to cause the substrate 20 to be removed therefromby the fluid under pressure causing the flexible planar interfacematerial 40 to either flex or ripple or deform or flex or bow or flex,ripple, deform, and bow as the fluid flows into the space between theobject 32 and the flexible planar interface material 40. After thesubstrate 20 is removed from the flexible planar interface material 40,a vacuum may be applied to the space between the object 32 and theflexible planar interface material 40 to cause the flexible planarinterface material 40 to engage the surface 34 of object 32.

The deformable material 30 may be any suitable well-known organic type,such as monomers, monomer mixtures, oligomers, and oligomer mixturesthat are solidified through curing. Alternately, the deformable material30 may be any suitable type epoxy resin which may be cured using an acidcatalyst.

The object 32 and flexible planar interface material 40 is kept throughthe application of suitable pressure thereto, or application of pressureto the wafer substrate 20, or the application of pressure to both theobject 32 and the wafer substrate 20 in engagement with the deformablematerial 30 until such material has hardened or solidified to form apermanent flat, planar surface 36 thereon being the mirror image of theflat, planar surface 34 on the object 32. At such time, the object 32and the flexible planar interface material 40 are removed fromengagement with the deformable material 30 using the application offluid under pressure to the space between the object 32 and the flexibleplanar interface material 40.

Also illustrated in drawing FIG. 5, is a flexible resilient member 50,having surfaces 52 and 54 thereon, comprising a suitably shaped membercompatible with the wafer substrate 20 formed of resilient materialwhich will deform under an applied force to uniformly distribute theapplied force from the object 32 to the deformable material 30, even ifthe surface 34 of object 32, the surfaces of flexible planar interfacematerial 40, illustrated as surfaces 42 and 44 of the member 40, and thesurface 36 of deformable material 30 on the wafer substrate 20 are notsubstantially parallel to each other or, alternately, when thicknessvariations locally exist within either the wafer 20, electrical circuitcomponents 22, insulative material 24, object 32, and/or flexibleresilient member 50. It is preferred that the flexible resilient member50 be thermally stable and resistant to the temperature ranges ofoperation experienced during the pressing by object 32 and flexibleplanar interface material 40 and that the member 50 be formed from a lowviscosity and low durometer hardness material. In this manner, theflexible resilient member 50 serves to compensate for the variations inthe thickness of the substrate 20, electrical circuit components 22,insulating material 24, deformable material 30, object 32, and flexibleplanar interface material 40 as well as compensating for anynon-parallel surfaces on the object 32 or the flexible planar interfacematerial 40 or the wafer 20 or the substrate or support 60 (150 indrawing FIG. 13) on which the wafer 20 is supported during the pressingof object 32 to form planar surface 36 on the deformable material 30prior to beginning the planarization process thereafter. The preferablemanner in which the coating 24 on a wafer 20 is to be globallyplanarized by etching or chemical mechanical planarization to have aglobally flat, planar surface 28 is to use the global planarizationprocess and apparatus described herein.

Referring to drawing FIG. 6, before the planarization process either bya dry chemical etching process or a chemical mechanical planarizationprocess of the coatings 28 and 30 on the circuits 22 on the wafer 20commences, the wafer substrate 20 having electrical circuit components22 and insulative coating 24 thereon is illustrated having thedeformable material 30 having a flat, planar surface 36 thereonproviding a global flat, planar surface 36 on the wafer substrate. Asillustrated, the global surface 36 on the deformable material 30 is aflat, planar surface from which a planarization process is to begin onthe wafer substrate 20. In this manner, a conventional well-knownplanarization process as described hereinbefore can be used to form flatplanar surfaces on the insulating material 24. By starting with aglobally flat, planar surface 36 on the deformable material 30 anydeformation of the pad 117 (FIG. 2) is minimized, if a chemicalmechanical planarization process is used. Also, any non-uniformplanarization which may occur due to the uneven distribution of thechemical reactive solution and abrasives included therein or materialparticles from the surfaces being planarized being collected or presentin the pad 117 resulting from surface irregularities is minimized. Inthis manner, by starting the chemical mechanical planarization processfrom a globally flat, planar surface 36 of the deformable material 30 asthe chemical mechanical planarization process is carried out, thesurfaces of the layers being planarized remain flat and planar becausethe pad 117 is subjected to more uniform loading and operation duringthe process. This is in clear contrast to the use of a chemicalmechanical planarization process beginning from an irregular nonplanarsurface as is typically carried out in the prior art. Similarly, if adry chemical etching planarization process is used, by starting the drychemical etching process from a globally flat, planar surface 36 of thedeformable material 30 as the dry chemical etching planarization processis carried out, the surfaces of the layers being planarized remain flatand planar because the chemical gases used in the dry etching processreact at the same rate on the flat and planar global surfaces of thecoatings 24 and 30 thereby keeping the surfaces globally flat. This isin clear contrast to the use of a chemical dry etching process beginningfrom an irregular nonplanar surface as is typically carried out in theprior art.

Referring to drawing FIG. 7, illustrated is a wafer substrate 20,electrical circuit components 22 and insulating layer 24 which have beenplanarized using the improved planarization process of the presentinvention. As illustrated, a flat, planar surface 28′ has been formedthrough the use of the planarization process using the object 32 andflexible innerface material 40 of the present invention as describedhereinbefore with a subsequent planarization process, such as a chemicalmechanical planarization process or a dry chemical etching process toform the flat planar surface 28′ of the insulating material 24.

Referring to drawing FIGS. 8A and 8B, the improved chemical mechanicalplanarization process of the present invention as described hereinbeforeis illustrated in a series of process steps 202 through 218.

In process step 202, a wafer substrate 20 is provided having electricalcircuitry components 22 formed thereon and an insulating materialcoating 24 covering the components 22 and portions of the wafersubstrate 20.

In process step 204, a coating of deformable material 30 which isuncured, unhardened, or not solidified at the time of application isapplied to the coating of insulating material 24 to cover the same.

Next, in process step 206, an object 32 having a flat planar surface 34thereon is provided for use.

In process step 208, the surface of deformable material is contacted bythe flat, planar surface 34 of the object 32.

In process step 210, a predetermined level of pressure is applied at apredetermined temperature level to the deformable material 30. Thepressure may be applied to either the object 32 having the flexibleplanar material interface 40 between the object 32 and substrate 20, thesubstrate 20, or both, etc.

In process step 212, flat, planar surface 34 of object 32 havingflexible planar material interface 40 thereover forms a flat, planarsurface 36 on the deformable material 30.

In process step 214, while the flat, planar surface of the flexibleplanar material interface 40 and the object 32 engages the deformablematerial 30 thereby forming the flat, planar surface 36 thereon, thedeformable material 30 is cured, hardened, or solidified to cause thepermanent formation and retention of the flat, planar surface 36 on thedeformable material 30.

In process step 216, the object 32 and flexible planar interfacematerial 40 are removed from engagement with the deformable material 30after the curing, hardening or solidification thereof to retain theflat, planar surface 36 thereon by the application of fluid pressure, asudden application of fluid pressure, such as a burst of fluid pressureto the space between the object 32 and flexible planar interfacematerial 40. Subsequent to the removal of the flexible planar interfacematerial 40 from the deformable material 30 of substrate 20, a vacuummay be applied to the space between the object 32 and flexible planarinterface material 40 to cause the flexible planar interface material 40to engage the surface 34 of object 32.

In process step 218, the wafer substrate 20 having electrical circuitcomponents 22, insulating coating 24, and cured, hardened, or solidifieddeformable coating 30 thereon is subjected to a suitable planarizationprocess until the upper surfaces 26′ of the electrical circuitcomponents and surface 28′ of the insulating material 24 are aconcurrent common flat, planar surface extending across the wafersubstrate 20 (see FIG. 7).

In this manner, when the improved process of chemical mechanicalplanarization of the present invention is used, the resulting planarizedsurface on the wafer substrate is globally planar or more planar sincethe process started from a globally flat, planar surface and thechemical mechanical planarization process reaches a successfulconclusion more quickly.

Alternately, the wafer substrate 20 having electrical circuit components22, insulating coating or material 24, and cured, hardened, orsolidified deformable coating 30 thereon is subjected to a suitable dryisotropical etching process in a suitable type plasma etcher until theupper surfaces 26′ of the electrical circuit components 22 an surface28′ of the insulating material 24 are substantially a concurrent commonflat, planar surface extending across the wafer substrate 20 (see FIG.7).

Referring to drawing FIGS. 9 through 12, the lid assemblies 300, 400,500, and 600 may be used with an apparatus such as described in drawingFIGS. 1 and 13 for the planarization of a coating on the surface of asemiconductor wafer.

Referring to drawing FIG. 9, a first embodiment of the present inventionis illustrated. A wafer press lid assembly 300 is illustrated for use inthe global planarization apparatus and process of the present invention.The lid assembly 300 comprises an upper lid 302, lid clamp 304, middlelid 306, lower lid 308, main chamber 310, object clamp 316, optical flatobject 32, interface clamp 382, flexible planar interface material 40,upper annular seal 312 which sealingly engages upper surface 330 of lidclamp 304 and the lower surface 324 of upper lid 302, lower annular seal314 which sealingly engages outer annular surface 356 of middle lid 306and the lower surface 334 of lid clamp 304, and annular seal 318 whichsealingly engages the outer diameter of optical flat object 32 and thefrusto-conical annular surface 395 of object clamp 316. The annularseals 312 and 314 may be any suitable seal type material, such anannular Teflon™ material type seal. The annular seal 318 may be anysuitable type seal, such as an elastomeric O-ring type seal, a siliconO-ring type seal, etc.

The upper lid 302 comprises a generally cylindrical annular memberhaving an upper surface 320, cylindrical inner surface 322, lowersurface 324, cylindrical outer surface 326, and a plurality of apertures328 therein which contain a plurality of threaded fasteners 329extending therethrough to retain the upper lid 302 in position securedto the lid clamp 304.

The lid clamp 304 comprises a generally cylindrical annular memberhaving an upper surface 330, inner cylindrical surface 332, lowersurface 334, outer cylindrical surface 338, and a plurality of threadedapertures 340 therein, each aperture 340 receiving a portion of athreaded fastener 321 extending therein to retain the lid clamp 304 inposition with respect to the upper lid 302.

The middle lid 306 comprises a generally cylindrical shaped annularmember having an upper surface 342, frusto-conical annular inner surface344 which sealing engages a portion of annular seal 318, innercylindrical surface 346, first cylindrical annular surface 348 having aplurality of threaded blind apertures 350 therein, first vertical outerdiameter surface 352, second cylindrical annular surface 354, and secondvertical outer diameter surface 356. The middle lid 306 further includesat least one aperture 358, alternately a plurality of apertures,extending therethrough from the second vertical outer diameter surface356 to the inner cylindrical surface 346 to allow a suitable gas orother fluid to flow therethrough, the at least one aperture 358 having asuitable connector 359 connected thereto for connection to a supply ofgas under pressure of fluid under pressure. The middle lid 304 furtherincludes a plurality of threaded apertures 357 therein, each aperture357 receiving and retaining a portion of threaded fastener 329 thereinto retain the middle lid 306 to the upper lid 302.

The lower lid 308 comprises a generally annular cylindrical memberhaving an upper surface 360 having an annular seal groove 362 thereinhaving, in turn, annular O-ring seal 364 therein, first vertical innercylindrical surface 366, inner annular surface 368 having a plurality ofblind apertures 370 therein to provide clearance for the heads ofthreaded fasteners 393 therein, second vertical inner cylindricalsurface 372, bottom or lower surface 374 having annular seal groove 376therein having, in turn, annular O-ring seal 378 therein, and outerdiameter cylindrical surface 380. The lower lid 308 further includes aplurality of apertures 382 therein extending from upper surface 360 tolower surface 374, each aperture containing a portion of a threadedfastener 383 therein to secure the lower lid 308 to the chamber 310. Theannular seal grooves 362 and 376 contain a suitable annular O-ring typeseal 364 and 378 therein, respectfully, such as an elastomeric O-ringtype seal, which sealingly engages the second annular cylindricalsurface 354 and upper surface of chamber 310.

The interface clamp 382 comprises a generally cylindrical annular memberhaving an upper surface 384, inner cylindrical surface 386, lowersurface 388, and outer cylindrical diameter 390. The interface clamp 382further includes a plurality of apertures 392 therein, each aperturehaving a portion of threaded fastener 393 extending therethrough toretain the interface clamp 380 connected to the middle lid 306 and toretain a portion of the flexible planar interface material 40 betweenthe interface clamp 380 and the first annular cylindrical surface 348 ofthe middle lid 306.

The chamber 310 comprises any suitable shaped chamber capable of holdinga substrate 20 therein for the planarization of the deformable coating30 on the surface thereof using the optical flat object 32 and flexibleplanar interface material 40, such as a metal cylindrical annularchamber 310 having a plurality of threaded blind apertures 311 extendingfrom the upper surface thereof into the wall of the chamber 310 toreceive threaded portions of the threaded fasteners 383 therein toretain the lower lid 308 connected thereto when a vacuum is created inthe chamber 310. The upper surface of the chamber 310 is suitable forthe annular O-ring seal 378 of lower lid 308 to sealingly engage to forma suitable pressure and vacuum seal therewith. The chamber may include athermocouple and a suitable heater therein, if desired.

The object clamp 316 comprises a generally annular cylindrical memberhaving an upper surface 393, inner diameter vertical surface 394,frusto-conical annular surface 395 which sealingly enagages a portion ofannular seal 318, lower surface 396 which abuts a portion of uppersurface 342 of middle lid 306, and outer diameter surface 397.

The flexible planar interface material 40 extends across the bottomsurface 36 of the optical flat object 32 by the interface clamp 382retaining the material 40 in the lid assembly 300. The flexible planarinterface material 40 may be any suitable type material, such as aplanar Teflon™ material, a synthetic resin polymer, etc., which allowsthe transmission of light therethrough which is used to cure, harden, orsolidify the deformable coating 30 on the coating 24 on the substrate20. Alternately, the flexible planar interface material 40 may be anysuitable type of material, such as planar Teflon™ material, a syntheticresin polymer, a flexible, planar thin metal material, etc. which doesnot need to allow for the transmission of light therethrough as thematerial forming the deformable coating 30 hardens, cures, orsolidifies. The flexible planar interface material 40 must havesufficient strength and thickness to resist any substantial thinningand/or stretching thereof during use, must have sufficient flexibilityduring use to conform to the surface of deformable coating 30 and allowremoval of the substrate 20 from the material 40 after the planarizationof the coating 30 and the removal of the interface material 40 from thesurface 34 of the object 32, must not be subject to any wrinklingthereof during use, etc. For instance, when using a Teflon™ flexibleplanar interface material 40, the thickness of the Teflon™ flexibleinterface material 40 is preferred to be in the range of 0.040 inchesthick to 0.005 inches thick for satisfactory use thereof. A thickness of0.010 inches has found to be effective and preferred for the use of aTeflon™ flexible planar interface material 40. If the thickness of theflexible planar interface material 40 is too great, the interfacematerial 40 will not flex sufficiently to allow ready removal of thesubstrate 20 from the material 40 after the planarization of the coating30 on the substrate 20 and will not allow for an effective planarizationof the coating 30 on the substrate 20 as the interface material 40 willlocally deform and deflect. Alternately, if the flexible planarinterface material 40 is too thin, the interface material 40 willstretch or tear or rip when subjected to forces during planarization andduring the application of fluid pressure thereto to remove the substrate20 therefrom.

The optical flat object 32 may be any suitable type material, such as anoptical grade glass flat or optical quality glass flat having acylindrical shape to fit in the clamp assembly 300 in sealing engagementtherewith which allows the transmission of light therethrough which isused to cure, harden, or solidify the deformable coating 30 on thecoating 24 on the substrate 20. Alternately, if light transmissionthrough the object 32 is not required, the object 32 may be of anysuitable type material having the desired flat surface 36 thereon, suchas ceramic material, stone material, or any material capable of havingthe desired flat surface thereon, etc.

To assist in removing the optical flat object 32 and the flexible planarinterface material 40 from the surface of the deformable coating 30 onthe substrate 20 after the curing, hardening, or solidification thereof,a pressurized fluid, such as a suitable gas is supplied throughaperture(s) 358 in the middle lid 306 into the area between the opticalflat object 32 and the interface material 40 to separate the interfacematerial 40 from the surface 34 of the object 32 and, also, by theflexing of the interface material 40 to separate the interface material40 from the surface 36 of the coating 30 to allow removal of thesubstrate 20 from the chamber 310. The pressurized fluid, such as a gas,may be any suitable gas supplied under pressure, such as compressed air,nitrogen, etc. If desired, a suitable liquid may be used rather than agas, such as water, oil, etc. So long as the liquid may be readilyremoved from the area or space between the surface 34 of object 32 andthe flexible planar interface material 40. When the pressurized fluid,such as a gas, is introduced between the surface 34 of object 32 and theflexible planar interface material 40, the pressurized fluid isintroduced at a rate, such as in a burst of pressurized fluid, causingthe rapid or very rapid flexing, or rippling, or bowing, or flexing,rippling, and bowing and/or movement of the material 40 to cause thesubstrate 20 to quickly suddenly release therefrom and to cause thematerial 40 to quickly, suddenly release from the surface 34 of object32. If desired, release agents may be used to enhance the release of thesubstrate 20 from the flexible planar interface material 40 and toenhance the release of the flexible planar interface material 40 fromthe surface 34 of object 32. The pressurized fluid, such as a gas,should not be introduced into the space between the surface 34 of object32 and flexible planar interface material 40 at such a rate to cause thethinning or wrinkling of the interface material 40 but, rather, causethe flexing thereof. An effective manner to remove the substrate 20 fromthe flexible planar interface material 40 and the flexible planarinterface material 40 from the surface 34 of object 32 is to supplypressurized fluid, such as a gas, into the space between the surface 34of object 32 and the flexible planar interface material 40 in a burst tocause the substrate 20 to pop, or rapidly be removed from the interfacematerial 40 and, subsequently, apply a vacuum to the space between thesurface 36 of object 32 and the flexible planar interface material 40 tocause the interface material 40 to adhere to the surface 34 of object32.

Referring to drawing FIG. 10, a second embodiment, the preferredembodiment, of the present invention is illustrated. A wafer press lidassembly 400 comprises an upper lid 402, lid clamp 404, a middle lid406, lower lid 408, chamber 410, object clamp 412, interface clamp 414,optical flat object 32, flexible planar interface material 40, annularseal 416 located between the lower surface 424 of upper lid 402 and theupper surface 430 of the lid clamp 404 and the upper surface 411 ofobject clamp 412, annular seal 418 located between the upper surface 440of middle lid 406 and the lower surface 434 of lid clamp 406, andannular O-ring type seal 401 which sealingly engages the outer diameterof optical flat object 32. The annular O-ring seal 401 may be of anysuitable material, such as described herein. The annular seal 416 andannular seal 418 may be of any suitable material as described herein.

The upper lid 402 comprises a generally cylindrical annular memberhaving an upper surface 420, an inner diameter surface 422, a lowersurface 424, and an outer diameter surface 426. The upper lid furtherincludes a plurality of apertures 428 therethrough, each aperturecontaining a portion of a threaded fastener 429 therein.

The lid clamp 404 comprises a generally cylindrical annular memberhaving an upper surface 430, inner cylindrical surface 432, lowersurface 434, outer cylindrical surface 436, and a plurality of apertures438 therein, each aperture 438 receiving a portion of a threadedfastener 429 extending therethrough to retain the lid clamp 404 inposition with respect to the upper lid 402.

The middle lid 406 comprises a generally cylindrical shaped annularmember having an upper surface 440, frusto-conical annular inner surface442 which sealing engages a portion of annular seal 401, innercylindrical surface 444, annular cylindrical lip 446 having a pluralityof radially extending grooves 448 therein, first cylindrical annularsurface 450 having a plurality of threaded blind apertures 452 therein,first vertical outer diameter surface 454, second cylindrical annularsurface 456, and second vertical outer diameter surface 458. The middlelid 406 further includes at least one aperture 460, alternately aplurality of apertures, extending therethrough from the second verticalouter diameter surface 458 to the inner cylindrical surface 444 to allowa suitable gas or other fluid to flow therethrough, the at least oneaperture 460 having a suitable connector 461 connected thereto forconnection to a supply of gas under pressure of fluid under pressure.The middle lid 406 further includes a plurality of threaded apertures459 therein, each aperture receiving a portion of threaded fastener 429therein to retain the middle lid 406 to the upper lid 402.

The lower lid 408 comprises a generally annular cylindrical memberhaving an upper surface 462 having an annular seal groove 464 thereinhaving, in turn, annular O-ring seal 466 therein, first vertical innercylindrical surface 468, inner annular surface 470 having a plurality ofblind apertures 472 therein to provide clearance for the heads ofthreaded fasteners 495 therein, second vertical inner cylindricalsurface 474, bottom or lower surface 476 having annular seal groove 478therein having, in turn, annular O-ring seal 480 therein, and outerdiameter cylindrical surface 482. The lower lid 408 further includes aplurality of apertures 484 therein extending from upper surface 462 tolower surface 476, each aperture containing a portion of a threadedfastener 485 therein to secure the lower lid 408 to the chamber 410. Theannular seal grooves 464 and 478 each contain a suitable annular O-ringtype seal 466 and 480 therein, respectfully, such as an elastomericO-ring type seal, which sealingly engages the second annular cylindricalsurface 456 and upper surface of chamber 410.

The interface clamp 414 comprises a generally cylindrical annular memberhaving an upper surface 486, inner cylindrical surface 488, lowersurface 490, and outer cylindrical diameter 492. The interface clamp 382further includes a plurality of apertures 494 therein, each aperturehaving a portion of threaded fastener 495 extending therethrough toretain the interface clamp 414 connected to the middle lid 406 and toretain a portion of the flexible planar interface material 40 betweenthe interface clamp 414 and the first annular cylindrical surface 450 ofthe middle lid 406.

The chamber 410 comprises any suitable shaped chamber capable of holdinga substrate 20 therein for the planarization of the deformable coating30 on the surface thereof using the optical flat object 32 and flexibleplanar interface material 40, such as a metal cylindrical annularchamber 410 having a plurality of threaded blind apertures 411 extendingfrom the upper surface thereof into the wall of the chamber 410 toreceive threaded portions of the threaded fasteners 485 therein toretain the lower lid 408 connected thereto when a vacuum is created inthe chamber 410. The upper surface of the chamber 410 is suitable forthe annular O-ring seal 480 of lower lid 408 to sealingly engage to forma suitable pressure and vacuum seal therewith. The chamber may include athermocouple and a heater therein, if desired.

The object clamp 412 comprises a generally annular cylindrical memberhaving an upper surface 411, inner diameter vertical surface 413,frusto-conical annular surface 415 which sealingly enagages a portion ofannular seal 401, lower surface 417 which abuts a portion of uppersurface 440 of middle lid 406, and outer diameter surface 419.

The flexible planar interface material 40 extends across the bottomsurface 36 of the optical flat object 32 by the interface clamp 414retaining the material 40 in the lid assembly 400. The flexible planarinterface material 40 may be any suitable type material, such as aplanar Teflon™ material, a synthetic resin polymer, etc., which allowsthe transmission of light therethrough which is used to cure, harden, orsolidify the deformable coating 30 on the coating 24 on the substrate20. Alternately, the flexible planar interface material 40 may be of anytype as described herein.

The optical flat object 32 may be any suitable type material, such as acylindrical optical glass flat shaped to fit in the clamp assembly 400in sealing engagement therewith which allow the transmission of lighttherethrough which is used to cure, harden, or solidify the deformablecoating 30 on the coating 24 on the substrate 20. Alternately, if lighttransmission through the object 32 is not required, the object 32 may beof any suitable type material having the desired flat surface 36thereon, such as ceramic material, stone material, or any materialcapable of having the desired flat surface thereon, etc.

To assist in removing the optical flat object 32 and the flexible planarinterface material 40 from the surface of the deformable coating 30 onthe substrate 20 after the curing, hardening, or solidification thereof,a pressurized fluid, such as a suitable gas is supplied throughapertures 460 in the lower lid 406 past annular seal 401 into the areabetween the optical flat object 32 and the interface material 40 toseparate the interface material 40 from the surface 34 of the object 32and, also, by the flexing of the interface material 40 to separate theinterface material 40 from the surface 36 of the coating 30 to allowremoval of the substrate 20 from the chamber 310. The pressurized fluid,such as a gas, may be any suitable gas supplied under pressure, such ascompressed air, nitrogen, etc. If desired, a suitable liquid may be usedrather than a gas, such as water, oil, etc. so long as the liquid may bereadily removed from the area or space between the surface 34 of object32 and the flexible planar interface material 40. The pressurized fluid,such as a suitable gas, is supplied through apertures 460 in the areabetween the optical flat object 32 and the flexible interface material40 to separate the interface material 40 from the surface 34 of theobject 32 and the coating 34 of the substrate 20 with a vacuum beingsubsequently applied through apertures 460 to the space between theobject 32 and interface material 40 to return the interface material 40to the surface 34 of object 32. When the pressurized fluid, such as agas, is introduced between the surface 34 of object 32 and the flexibleplanar interface material 40, the pressurized fluid is introduced at arate, such as in a burst of pressurized fluid, causing the rapid or veryrapid flexing, or rippling, or bowing, or flexing, rippling, and bowingand/or movement of the interface material 40 to cause the substrate 20to quickly suddenly release therefrom and to cause the interfacematerial 40 to quickly, suddenly release from the surface 34 of object32. If desired, release agents may be used to enhance the release of thesubstrate 20 from the flexible planar interface material 40 and toenhance the release of the substrate 20 from the flexible planarinterface material 40 and to enhance the release of the flexible planarinterface material 40 from the surface 32 of object 32. The pressurizedfluid, such as a gas, should not be introduced into the space betweenthe surface 34 of object 32 and the flexible planar interface material40 at such a rate to cause the thinning or wrinkling of the material 40but, rather, cause the flexing thereof. An effective manner to removethe substrate 20 from the flexible planar interface material 40 and theflexible planar interface material 40 from the surface 34 of the object32 is to supply pressurized fluid, such as a gas, into the space betweenthe surface 34 of object 32 and the flexible planar interface material40 in a burst to cause the substrate 20 to pop, or rapidly be removedfrom the material 40, and subsequently, apply a vacuum to the spacebetween the surface 34 of object 32 and the flexible planar interfacematerial 40 to cause the interface material to adhere to the surface 34of object 32.

Referring to drawing FIG. 11, The middle lid 406 is illustrated in aperspective view to show the radially extending grooves 448 in theannular cylindrical lip 446 therein for the suitable gas suppliedthrough at least one aperture 460 thereto.

Referring to drawing FIG. 12, a third embodiment of the presentinvention is illustrated. The wafer press lid assembly 500 comprises anupper lid 502, lid clamp 504, a middle lid 506, lower lid 508, chamber510, interface clamp 512, annular seal 514 sealingly engaging the lowersurface 524 of upper lid 502 and the upper surface 530 of middle lid 506and upper surface 544 of lid clamp 504, annular seal 516 sealinglyengaging the lower surface 534 of lid clamp 504 and first upper surface540 of middle lid 506, optical flat object 32, and flexible planarinterface material 40. The annular seal 503 may be of any suitablematerial as described hereinbefore.

The upper lid 502 comprises a generally cylindrical annular memberhaving an upper surface 520, inner diameter surface 522, lower surface524, and an outer diameter surface 526. The upper lid 502 furtherincludes a plurality of apertures 528, each aperture 528 having aportion of a threaded fastener 529 extending therethrough.

The lid clamp 504 comprises a generally cylindrical annular memberhaving an upper surface 530, inner cylindrical surface 532, lowersurface 534, outer cylindrical surface 536, and a plurality of apertures538 therein, each aperture 538 receiving a portion of a threadedfastener 529 extending therethrough to retain the lid clamp 504 inposition with respect to the upper lid 502.

The middle lid 506 comprises a generally cylindrical annular memberhaving a first upper surface 540, vertical cylindrical surface 542,second upper surface 544, first inner diameter vertical surface 546having annular groove 548 therein, having, in turn, annular O-ring seal550 therein sealingly engaging a surface of the optical flat object 32,annular cylindrical surface 552 having annular groove 554 thereinhaving, in turn, annular O-ring seal 554 therein sealingly engaging asurface of the optical flat object 32, second inner diameter verticalsurface 558, bottom or lower surface 560, and outer diameter surface562. The middle lid 506 further includes at least one aperture 564extending from the outer diameter surface 562 to the second innerdiameter vertical surface 558 for the supply of a suitable gastherethrough, the outer portion of the at least one aperture 564 beingthreaded for the connection of a suitable supply of pressurized fluid,such as a gas under pressure thereto or other suitable fluid, aplurality of threaded apertures 566, each aperture 566 threadedreceiving a portion of threaded fastener 599 therein, and a plurality ofthreaded apertures 568 in first upper surface 540, each aperture 568threadedly receiving a portion of threaded fastener 529 therein.

The lower lid 508 comprises a generally annular cylindrical memberhaving an upper surface 570 having an annular seal groove 572 thereinhaving, in turn, annular O-ring seal 574 therein, first vertical innercylindrical surface 576, inner annular surface 578 having a plurality ofblind apertures 580 therein to provide clearance for the heads ofthreaded fasteners 599 therein, second vertical inner cylindricalsurface 582, lower surface 584 having annular seal groove 586 thereinhaving, in turn, annular O-ring seal 588 therein, and outer diametercylindrical surface 590. The lower lid 508 further includes a pluralityof apertures 592 therein extending from upper surface 570 to lowersurface 584, each aperture 592 containing a portion of a threadedfastener 593 therein to secure the lower lid 508 to the chamber 510. Theannular seal grooves 572 and 586 each contain a suitable annular O-ringtype seal 574 and 588 therein, respectfully, such as an elastomericO-ring type seal, which sealingly engage lower surface 560 of the middlelid 506 and the upper surface of the chamber 510.

The interface clamp 512 comprises a generally cylindrical annular memberhaving an upper surface 594, inner diameter 595, lower surface 596, andinner annular extending lip 597 having a plurality of apertures 598therein, each aperture having a portion of threaded fastener 599extending therethrough engaging a blind threaded aperture 566 in themiddle lid 506 to secure the interface clamp 512 thereto and to retain aportion of the flexible planar interface material 40 secured between theinterface clamp 506 and the lower surface 556 of the middle lid 506.

The chamber 510 comprises any suitable shaped chamber capable of holdinga substrate 20 therein for the planarization of the deformable coating30 on the surface thereof using the optical flat object 32 and flexibleplanar interface material 40, such as a metal cylindrical annularchamber 510 having a plurality of threaded blind apertures 511 extendingfrom the upper surface thereof into the wall of the chamber 510 toreceive threaded portions of the threaded fasteners 593 therein toretain the lower lid 508 connected thereto when a vacuum is created inthe chamber 410. The upper surface of the chamber 510 is suitable forthe annular O-ring seal 588 of lower lid 508 to sealingly engage to forma suitable pressure and vacuum seal therewith. The chamber may include athermocouple and heater therein, if desired.

The flexible planar interface material 40 extends across the bottomsurface 34 of the optical flat object 32 by the interface clamp 512retaining the material 40 in the lid assembly 500. The flexible planarinterface material 40 may be any suitable type material, such as aplanar Teflon™ material, a synthetic resin polymer, etc., which allowsthe transmission of light therethrough which is used to cure, harden, orsolidify the deformable coating 30 on the coating 24 on the substrate20. Alternately, the flexible planar interface material 40 may be of anysuitable type material and thickness as described herein, such as planarTeflon™ material, a synthetic resin polymer, a flexible planar thinmetal material, etc. which does not need to allow for the transmissionof light therethrough as the material forming the deformable coating 30hardens, curs, or solidifies. The flexible planar interface material 40must have sufficient strength and thickness to resist any substantialthinning and/or stretching thereof during use, must have sufficientflexibility during use to conform to the surface of deformable coating30 and allow removal of the substrate 20 from the material 40 after theplanarization of the coating 30 and the removal of the material 40 fromthe surface 34 of the object 32, must not be subject to any wrinklingthereof during use, etc. For instance, when using a Teflon™ flexibleplanar interface material 40, the thickness of the Teflon™ flexibleplanar interface material is preferred to be in the range of 0.040inches thick to 0.005 inches thick for satisfactory use thereof. Athickness of 0.010 inches is preferred for the use of a Teflon™ flexibleinterface material 40. If the thickness of the flexible planar interfacematerial 40 is too great, the interface material 40 will not flexsufficiently to allow ready removal of the substrate 20 from theinterface material 40 after the planarization of the coating 30 on thesubstrate 20 and will not allow for an effective planarization of thecoating 30 on the substrate 20 as the material 40 will locally deformand deflect. Alternately, if the flexible planar interface material 40is too thin, the interface material 40 will stretch or tear or rip whensubjected to forces during planarization and during the application offluid pressure thereto to remove the substrate 20 therefrom.

The optical flat object 32 may be any suitable type material, such as acylindrical optical glass flat shaped to fit in the clamp assembly 400in sealing engagement therewith which allow the transmission of lighttherethrough which is used to cure, harden, or solidify the deformablecoating 30 on the coating 24 on the substrate 20. Alternately, if lighttransmission through the object 32 is not required, the flat object 32may be of any suitable material as described herein having the desiredflat surface 34 thereon, such as ceramic material, stone material, orany material capable of having the desired flat surface thereon, etc.

To assist in removing the optical flat object 32 and the flexible planarinterface material 40 from the surface of the deformable coating 30 onthe substrate 20 after the curing, hardening, or solidification thereof,a pressurized fluid, such as a suitable gas is supplied through the atleast one aperture 564 in the middle lid 506 into the area between theoptical flat object 32 and the interface material 40 to separate theinterface material 40 from the surface 34 of the object 32 and, also, bythe flexing of the interface material 40 to separate the interfacematerial 40 from the surface 36 of the coating 30 to allow removal ofthe substrate 20 from the chamber 310. The pressurized fluid, such as agas, may be any suitable gas supplied under pressure, such as compressedair, nitrogen, etc. If desired, a suitable liquid may be used ratherthan a gas, such as water, oil, etc. so long as the liquid may bereadily removed from the area or space between the surface 34 of object32 and the flexible planar interface material 40. When the pressurizedfluid, such as a gas, is introduced between the surface 34 of object 32and the flexible planar interface material 40, the pressurized fluid isintroduced at a rate, such as in a burst of pressurized fluid, causingthe rapid or very rapid flexing, or rippling, or bowing, or flexing,rippling and bowing and/or movement of the interface material 40 toquickly, suddenly release the surface 34 of object 32. If desire,release agents may be used to enhance the release of the substrate 20from the flexible planar interface material 40 and to enhance therelease of the flexible planar interface material 40 from the surface 34of object 32. The pressurized fluid, such as a gas, should not beintroduced into the space between the surface 34 of object 32 andflexible planar interface material 40 at such a rate to cause thethinning or wrinkling of the interface material 40 but, rather, causethe flexing thereof. An effective manner to remove the substrate 20 fromthe flexible planar interface material 40 and the flexible planarinterface material 40 from the surface 34 of object 32 is to supplypressurized fluid, such as a gas, into the space between the surface 34of object 32 and the flexible planar interface material 40 in a burst tocause the substrate to pop, or rapidly be removed from the interfacematerial 40 and, subsequently, apply a vacuum to the space between thesurface 34 of object 32 and the flexible planar interface material 40 tocause the material 40 to adhere to the surface 34 of object 32.

Referring to drawing FIG. 13, a fourth embodiment of the presentinvention is illustrated. A wafer press lid assembly 600 comprises anupper lid 602, lid clamp 604, a middle lid 606, lower lid 608, chamber610, object clamp 612, flexible planar interface material 40, annularseal 616 located between the lower surface 624 of upper lid 602 and theupper surface 630 of the lid clamp 604 and object clamp 612, annularseal 618 located between the upper surface 640 of middle lid 606 and thelower surface 634 of lid clamp 404, and annular O-ring type seal 601which sealingly engages the outer diameter of optical flat object 32,frusto-conical annular surface 682 of object clamp 612, andfrusto-conical annular surface 642 of middle lid 606. The annular O-ringseal 601 may be of any suitable material, such as described herein. Theannular seal 616 and annular seal 618 may be of any suitable material asdescribed herein.

The upper lid 602 comprises a generally cylindrical annular memberhaving an upper surface 620, an inner diameter surface 622, a lowersurface 624, and an outer diameter surface 626. The upper lid furtherincludes a plurality of apertures 628 therethrough, each aperturecontaining a portion of a threaded fastener 629 therein.

The lid clamp 604 comprises a generally cylindrical annular memberhaving an upper surface 630, inner cylindrical surface 632, lowersurface 634, outer cylindrical surface 636, and a plurality of apertures638 therein, each aperture 638 receiving a portion of a threadedfastener 629 extending therethrough to retain the lid clamp 604 inposition with respect to the upper lid 602.

The middle lid 606 comprises a generally cylindrical shaped annularmember having an upper surface 640, frusto-conical annular inner surface642 which sealing engages a portion of annular seal 601, innercylindrical surface 644, first lower surface 646, first vertical outerdiameter 648, second lower surface 650, and outer diameter surface 652.The middle lid 606 further includes a plurality of threaded apertures654, extending therethrough from the upper surface 640 to the secondlower surface 650, each aperture threadedly receiving a portion ofthreaded fastener 629 therein to retain the middle lid 606 to the upperlid 602.

The lower lid 608 comprises a generally annular cylindrical memberhaving a first upper surface 656 having an annular seal groove 658therein having, in turn, annular O-ring seal 660 therein, first verticalinner cylindrical surface 662, inner annular surface 664, secondvertical cylindrical inner diameter 666, bottom surface 668 havingannular seal groove 670 therein having, in turn, annular O-ring seal 672therein, and outer diameter cylindrical surface 674. The lower lid 608further includes a plurality of apertures 676 therein extending fromfirst upper surface 656 to lower surface 668, each aperture containing aportion of a threaded fastener 677 therein to secure the lower lid 608to the chamber 610. The annular seal grooves 658 and 670 each contain asuitable annular O-ring type seal 660 and 672 therein, respectfully,such as an elastomeric O-ring type seal, which sealingly engages thesecond lower surface 650 of middle lid 606 and upper surface of chamber610.

The chamber 610 comprises any suitable shaped chamber capable of holdinga substrate 20 therein for the planarization of the deformable coating30 on the surface thereof using the optical flat object 32 and flexibleplanar interface material 40, such as a metal cylindrical annularchamber 610 having a plurality of threaded blind apertures 611 extendingfrom the upper surface thereof into the wall of the chamber 610 toreceive threaded portions of the threaded fasteners 677 therein toretain the lower lid 608 connected thereto when a vacuum is created inthe chamber 410. The upper surface of the chamber 610 is suitable forthe annular O-ring seal 672 of lower lid 608 to sealingly engage to forma suitable pressure and vacuum seal therewith. The chamber may include athermocouple and a heater therein, if desired.

The object clamp 612 comprises a generally annular cylindrical memberhaving an upper surface 678, inner diameter vertical surface 680,frusto-conical annular surface 682 which sealingly enagages a portion ofannular seal 401, lower surface 684 which abuts a portion of uppersurface 640 of middle lid 606, and outer diameter surface 686.

The flexible planar interface material 40 extends across the bottomsurface 36 of the optical flat object 32 by middle lid 606 and the lowerlid 608 retaining the material 40 in the lid assembly 600. The flexibleplanar interface material 40 may be any suitable type material, such asa planar Teflon™ material, a synthetic resin polymer, etc., which allowsthe transmission of light therethrough which is used to cure, harden, orsolidify the deformable coating 30 on the coating 24 on the substrate20. The flexible planar interface material 40 is retained in the lidassembly 600 below the object 32 by the first lower surface 646 of themiddle lid 606 and the inner annular surface 664 of the lower lid 608.

The optical flat object 32 may be any suitable type material, such as acylindrical optical glass flat shaped to fit in the clamp assembly 600in sealing engagement therewith which allow the transmission of lighttherethrough which is used to cure, harden, or solidify the deformablecoating 30 on the coating 24 on the substrate 20.

To remove the flexible planar interface material 40 from the surface ofthe optical flat object 32 after the curing, hardening, orsolidification of the deformable coating 30 on the substrate 20, theflexible planar interface material is pulled away or peeled from thecoating 30 and peeled or pulled away from the surface 34 of the object32. A new piece of flexible planar interface material 40 is installed inthe assembly 600 for use with another substrate 20 having a deformablecoating 30 thereon.

Referring to drawing FIG. 14, the present invention is shown with achamber for the planarization of a deformable surface, such as surface32 of deformable material 30 on a wafer 20 illustrated in drawing FIGS.4 through 7. A chamber 310, 408, 574, 608, as described hereinbefore, isused with a lid press assembly 300, 400, 500, 600, as describedhereinbefore, to planarize a deformable surface 32 on a wafer 20. Aninterface 40 is used between the optical flat object 32 in the lidassembly and the wafer 20. The wafer 20 is placed on a wafer support 150on a lifting apparatus 140, such as described hereinbefore for theplanarization process of deformable surface 32 on wafer 20. A resilientmember 160 may be included below the wafer 20 on the support 150. Thechamber is subjected to a vacuum using aperture 111 therein. Athermocouple 192 may be included to sense the temperature generated byheater 190 within the chamber.

It will be understood that changes, additions, modifications, anddeletions may be made to the improved chemical mechanical planarizationprocess of the present invention, which are clearly within the scope ofthe claimed invention.

What is claimed is:
 1. A method for planarizing a non-planar filmsurface of a wafer, said method comprising the steps of: providing saidwafer; providing an interface material; securing the interface materialin a position; contacting said non-planar film surface of said waferwith the interface material; forming a substantially flat planar surfaceon said non-planar film surface of said wafer.
 2. The method of claim 1,further comprising: planarizing said wafer using a planarizationprocess.
 3. The method of claim 1, further comprising the step of:applying a fluid under pressure to one side of the interface material.4. The method of claim 1, wherein forming the substantially flat planarsurface includes the step of: coating said surface of said wafer with adeformable material.
 5. The method of claim 4, further comprising thestep of: contacting the deformable material with the interface material.6. The method of claim 5, further comprising the step of: contacting theinterface material with an object.
 7. The method of claim 6, furthercomprising the step of: applying a fluid under pressure between theinterface material and the object.
 8. The method of claim 5, furthercomprising the step of: curing the deformable material while theinterface material is contacting the deformable material.
 9. The methodof claim 5, further comprising the step of: hardening the deformablematerial while the interface material is contacting the deformablematerial.
 10. The method of claim 5, further comprising the step of:solidifying the deformable material while the interface material iscontacting the deformable material.
 11. The method of claim 5, furthercomprising the step of: applying pressure to the interface materialcontacting the deformable material while the interface material contactsthe deformable material.
 12. The method of claim 5, further comprisingthe step of: applying pressure to the coating of deformable material onthe surface of the wafer while the interface material contacts thedeformable material.
 13. The method of claim 5, wherein the interfacematerial includes a substantially flat planar surface thereon contactingthe deformable material.
 14. The method of claim 6, wherein the objectincludes a shaped surface thereon contacting the deformable material.15. The method of claim 13, wherein the shaped surface includes a convexsurface portion.
 16. The method of claim 13, wherein the shaped surfaceincludes a concave surface portion.
 17. The method of claim 13, whereinthe shaped surface includes a convex surface portion and a concavesurface portion.
 18. The method of claim 6, wherein the object includesa flat optical glass object.
 19. The method of claim 5, furtherincluding the step of: coating the interface material with a releaseagent prior to contacting the deformable material.
 20. The method ofclaim 6, further including the step of: coating the object with arelease agent prior to contacting the interface material.
 21. The methodof claim 6, wherein the object includes a substantially inflexibleobject having a flat surface thereon.
 22. The method of claim 4, furthercomprising the step of: contacting the interface material with a member.23. The method of claim 22, further comprising the step of: applying afluid under pressure to the interface material and to the member. 24.The method of claim 21, wherein the back of the wafer is contacted witha resilient member.
 25. The method of claim 21, further comprising thestep of: applying pressure to the flexible resilient member to form asubstantially flat planar surface on the deformable material.
 26. Themethod of claim 21, further comprising the steps of: contacting theflexible resilient member with a substrate; and applying pressure to thesubstrate thereby applying pressure to the flexible resilient member.27. The method of claim 24, further comprising the steps of: applyingpressure to the wafer through the flexible resilient member therebyapplying pressure to the object thereby deforming the coating ofdeformable material on the wafer.
 28. The method of claim 1, whereinsaid wafer includes a wafer having electrical circuit components on asurface thereof.
 29. The method of claim 1, wherein said wafer includesa wafer having a plurality of electrical circuits on a surface thereofand a coating substantially covering the electrical circuit components.30. The method of claim 1, wherein said wafer includes a wafer having aplurality of electrical components on a surface thereof and a coatingsubstantially covering the electrical components and said wafer.
 31. Themethod of claim 5, further comprising the step of: applying pressure tothe interface material while the interface material contacts thedeformable material.
 32. The method of claim 6, further comprising thestep of: applying a substantially uniform pressure to the object whilethe object is in contact with the interface material.
 33. The method ofclaim 5, further comprising the step of: applying a substantiallyuniform pressure to the deformable material on the surface of the waferto form a substantially flat planar surface on the deformable material.34. The method of claim 2, wherein the planarization process includes achemical mechanical planarization process.
 35. The method of claim 2,wherein the planarization process includes a chemical etching process.36. The method of claim 3, further comprising: applying a vacuum to theinterface material.
 37. A method for planarizing a non-planar filmsurface of a wafer having at least one electrical circuit formedthereon, said method comprising the steps of: providing said wafer:providing an interface material; securing the interface material in aposition; forming a substantially flat planar surface on said non-planarfilm surface of said wafer; and planarizing said substantially flatplanar surface on said wafer using a planarization process.
 38. Themethod of claim 37, further comprising the step of: applying a fluidunder pressure to the interface material.
 39. The method of claim 37,further comprising: applying a vacuum to the interface material.
 40. Themethod of claim 37, wherein the planarization process includes achemical mechanical planarization process.
 41. The method of claim 37,wherein the planarization process includes an etching process.
 42. Themethod of claim 37, wherein forming the substantially flat planarsurface includes the step of: coating said surface of said wafer with adeformable material.
 43. The method of claim 37, further comprising thestep of: contacting the interface material with an object.
 44. Themethod of claim 43, further comprising the step of: curing thedeformable material while the object contacts the interface material.45. The method of claim 43, further comprising the step of: hardeningthe deformable material while the object contacts the interfacematerial.
 46. The method of claim 43, further comprising the step of:solidifying the deformable material while the object contacts theinterface material.
 47. The method of claim 43, further comprising thestep of: applying pressure to the object contacting the interfacematerial while the interface material contacts the deformable material.48. The method of claim 42, further comprising the step of: applyingpressure to the coating of deformable material on the surface of thewafer while the interface material contacts the deformable material. 49.The method of claim 43, wherein the object includes a substantially flatplanar surface thereon contacting the interface material.
 50. The methodof claim 43, wherein the object includes a shaped surface thereoncontacting the interface material.
 51. The method of claim 50, whereinthe shaped surface includes a convex surface portion.
 52. The method ofclaim 50, wherein the shaped surface includes a concave surface portion.53. The method of claim 50, wherein the shaped surface includes a convexsurface portion and a concave surface portion.
 54. The method of claim50, wherein the shaped surface includes a desired shaped surface. 55.The method of claim 43, wherein the object includes a flat optical glassobject.
 56. The method of claim 43, further including the step of:coating the object with a release agent prior to contacting theinterface material.
 57. The method of claim 43, wherein the objectincludes a substantially inflexible object.
 58. The method of claim 37,further comprising the step of: contacting the wafer with a resilientmember.
 59. The method of claim 37, wherein the back of the wafer iscontacted with a resilient member.
 60. The method of claim 59, furthercomprising the steps of: applying pressure to the resilient member toform a substantially flat planar surface on the deformable material. 61.The method of claim 59, further comprising the steps of: contacting theflexible resilient member with a substrate; and applying pressure to thesubstrate thereby applying pressure to the flexible resilient member.62. The method of claim 59, further comprising the steps of: applyingpressure to the wafer by applying pressure to the flexible resilientmember thereby applying pressure to the object.
 63. The method of claim37, wherein said wafer includes a wafer having a plurality of electricalcircuit components on a surface thereof.
 64. The method of claim 37,wherein said wafer includes a wafer having a plurality of electricalcomponents on a surface thereof and a coating substantially covering theelectrical components.
 65. The method of claim 37, wherein said waferincludes a wafer having a plurality of electrical circuits on a surfacethereof and a coating substantially covering the electrical circuits andsaid wafer.
 66. The method of claim 43, further comprising the step of:applying pressure to the object while the object is in contact with theinterface material.
 67. The method of claim 43, further comprising thestep of: applying a substantially uniform pressure to the object whilethe interface material is in contact with the deformable material. 68.The method of claim 37, further comprising the step of: applying asubstantially uniform pressure to the deformable material on the surfaceof the wafer to form a substantially flat planar surface on thedeformable material.
 69. A method for planarizing a non-planar filmsurface of a wafer, said method comprising the steps of: providing saidwafer; providing an interface material; securing the interface materialin a position; applying a deformable material to said non-planar filmsurface of said wafer; contacting the deformable material by theinterface material; forming a substantially flat planar surface on saiddeformable material applied to said non-planar film surface of saidwafer; and applying a fluid under pressure to the interface material.70. The method of claim 69, further comprising: applying a vacuum to theinterface material.
 71. The method of claim 69, further comprising:planarizing said wafer using planarization process.
 72. The method ofclaim 69, wherein the planarization process includes a chemicalmechanical planarization process.
 73. The method of claim 69, whereinthe planarization process includes an etching process.
 74. A method forplanarizing a non-planar film surface of a wafer, said method comprisingthe steps of: providing an interface material in a secured in aposition; providing an object having a flat planar surface thereon;providing said wafer; applying a deformable material to said non-planarfilm surface of said wafer; contacting the interface material with theobject; contacting the deformable material with the interface material;forming a substantially flat planar surface on said deformable materialon said non-planar film surface of said wafer; and applying a fluidunder pressure to the interface material.
 75. The method of claim 74,further comprising: applying a vacuum to the interface material.
 76. Themethod of claim 74, further comprising: planarizing said wafer using aplanarization process.
 77. A method for planarizing a non-planar filmsurface of a wafer, said method comprising the steps of: providing aninterface material secured in a position; providing said wafer;providing an object having a flat planar surface thereon; providing aflexible resilient member at the back of the wafer; applying adeformable material to said non-planar film surface of said wafer;contacting the deformable material; forming a substantially flat planarsurface on said deformable material on said non-planar film surface ofsaid wafer; and applying a fluid under pressure to the interfacematerial.
 78. The method of claim 77, further comprising: applying avacuum to the interface material.
 79. The method of claim 77, furthercomprising: planarizing said wafer using a planarization process. 80.The method of claim 77, wherein the deformable material is contacted bythe interface material.
 81. A method for planarizing a non-planar filmsurface of a wafer, said method comprising the steps of: providing saidwafer; providing an interface material secured in a position; providingan object having a flat planar surface thereon; providing a flexibleresilient member; applying a deformable material to said non-planar filmsurface of said wafer; contacting the back of the wafer with theflexible resilient member; applying pressure to the deformable material;forming a substantially flat planar surface on said deformable materialon said non-planar film surface of said wafer; applying a fluid underpressure to the interface material; and planarizing said wafer using aplanarization process.
 82. The method of claim 81, further comprising:applying a vacuum to the interface material.
 83. A method forplanarizing a non-planar surface of a wafer, said method comprising thesteps of: providing said wafer; providing an interface material securedin a position; forming a substantially flat planar surface on saidnon-planar surface of said wafer; applying a fluid under pressure to theinterface material; and planarizing said wafer using a planarizationprocess.
 84. The method of claim 83, further comprising: applying avacuum to the interface material.
 85. A method for planarizing anon-planar surface of a wafer having at least one electrical circuitformed thereon, said method comprising the steps of: providing saidwafer; providing an interface material secured in a position; forming asubstantially flat planar surface on said non-planar surface of saidwafer; applying a fluid under pressure to the interface material; andplanarizing said substantially flat planar surface on said wafer using aplanarization process.
 86. The method of claim 85, further comprising:applying a vacuum to the interface material.
 87. A method forplanarizing a non-planar surface of a wafer, said method comprising thesteps of: providing said wafer; providing an interface material securedin a position; applying a deformable material to said non-planar surfaceof said wafer; forming a substantially flat planar surface on saiddeformable material applied to said non-planar surface of said wafer;applying a fluid under pressure to the interface material; andplanarizing said wafer using a planarization process.
 88. The method ofclaim 87, further comprising: applying a vacuum to the interfacematerial.
 89. A method for planarizing a non-planar surface of a wafer,said method comprising the steps of: providing an interface materialsecured in a position; providing an object having a flat planar surfacethereon; providing said wafer; applying a deformable material to saidnon-planar surface of said wafer; contacting the deformable materialwith the interface material; forming a substantially flat planar surfaceon said deformable material on said non-planar surface of said wafer;applying a fluid under pressure to the interface material; andplanarizing said wafer using a planarization process.
 90. The method ofclaim 89, further comprising: applying a vacuum to the interfacematerial.
 91. A method for planarizing a non-planar surface of a wafer,said method comprising the steps of: providing said wafer; providing aninterface material retained in a position; providing an object having aflat planar surface thereon; providing a flexible resilient member atthe back of the wafer; applying a deformable material to said non-planarsurface of said wafer; contacting the deformable material; forming asubstantially flat planar surface on said deformable material on saidnon-planar surface of said wafer; applying a fluid under pressure to theinterface material; and planarizing said wafer using a planarizationprocess.
 92. The method of claim 91, further comprising: applying avacuum to the interface material.
 93. The method of claim 91, whereinthe interface material is contacted by an object.
 94. A method forplanarizing a non-planar surface of a wafer, said method comprising thesteps of: providing said wafer; providing an interface material retainedin a position; providing an object having a flat planar surface thereon;providing a flexible resilient member; applying a deformable material tosaid non-planar surface of said wafer; contacting the back of the waferwith the flexible resilient member; applying pressure to the deformablematerial; forming a substantially flat planar surface on said deformablematerial on said non-planar surface of said wafer; applying a fluidunder pressure to the interface material; and planarizing said waferusing a planarization process.
 95. The method of claim 94, furthercomprising: applying a vacuum to the interface material.
 96. A methodfor planarizing a non-planar surface of a wafer, said method comprisingthe steps of: providing said wafer; providing an interface materialretained in a position; forming a substantially flat planar surface onsaid non-planar surface of said wafer; removing the interface materialfrom said wafer using a fluid under pressure; and planarizing saidsubstantially flat planar surface on said non-planar surface of saidwafer using a planarization process.
 97. The method of claim 96, furthercomprising: applying a vacuum to the interface material.
 98. A methodfor planarizing a non-planar surface of a wafer having at least oneelectrical circuit formed thereon, said method comprising the steps of:providing said wafer; providing an interface material retained in aposition; forming a substantially flat planar surface on said non-planarsurface of said wafer; removing the interface material from the waferusing a fluid; and planarizing said substantially flat planar surface onsaid non-planar surface of said wafer using a planarization process. 99.The method of claim 98, further comprising: applying a vacuum to theinterface material.
 100. A method for planarizing a non-planar surfaceof a wafer, said method comprising the steps of: providing said wafer;providing an interface material retained in a position; applying adeformable material to said non-planar surface of said wafer; forming asubstantially flat planar surface on said deformable material applied tosaid non-planar surface of said wafer; removing the interface materialfrom said wafer using a fluid; and planarizing said substantially flatplanar surface on said non-planar surface of said wafer using aplanarization process.
 101. The method of claim 100, further comprising:applying a vacuum to the interface material.
 102. A method forplanarizing a non-planar surface of a wafer, said method comprising thesteps of: providing an interface material retained from substantialmovement; providing an object having a flat planar surface thereon;providing said wafer; applying a deformable material to said non-planarsurface of said wafer; contacting the interface material by the object;contacting the deformable material with the interface material; forminga substantially flat planar surface on said deformable material on saidnon-planar surface of said wafer; removing the interface material fromsaid wafer; and planarizing said wafer using a planarization process.103. The method of claim 102, further comprising: applying a vacuum tothe interface material.
 104. A method for planarizing a non-planarsurface of a wafer, said method comprising the steps of: providing saidwafer; providing an interface material substantially retained in aposition; providing an object having a flat planar surface thereon;providing a flexible resilient member at the back of the wafer; applyinga deformable material to said non-planar surface of said wafer;contacting the deformable material; forming a substantially flat planarsurface on said deformable material on said non-planar surface of saidwafer; removing the interface material from said wafer; and planarizingsaid substantially flat planar source on said deformable material onsaid non-planar surface of said wafer using a planarization process.105. The method of claim 104, further comprising: applying a vacuum tothe interface material.
 106. The method of claim 104, wherein theinterface material is contacted by an object.
 107. A method forplanarizing a non-planar surface of a wafer, said method comprising thesteps of: providing said wafer; providing an interface materialsubstantially secured in a position; providing an object having a flatplanar surface thereon; providing a flexible resilient member; applyinga deformable material to said non-planar surface of said wafer;contacting the back of the wafer with the flexible resilient member;applying pressure to the deformable material; forming a substantiallyflat planar surface on said deformable material on said non-planarsurface of said wafer; removing the interface material from said waferusing a fluid; and planarizing said substantially flat planar surface onsaid deformable material on said non-planar surface of said wafer usinga planarization process.
 108. The method of claim 107, furthercomprising: applying a vacuum to the interface material.
 109. Anapparatus for the planarization of a surface on wafer, said apparatuscomprising: an object having an upper surface, lower surface, and outerdiameter, the object located above said wafer; and an interface materiallocated below the lower surface of the object, the interface materialsubstantially retained in a position.
 110. The apparatus of claim 109,further comprising: a lid assembly, the lid assembly including theobject therein.
 111. The apparatus of claim 109, further comprising: alid assembly including: an upper lid; a middle lid having an uppersurface, lower surface, inner surface, and outer surface, the middle lidlocated between the upper lid and the lower lid; and a lower lid havinga portion thereof located below the lower surface of the object. 112.The apparatus of claim 111, further comprising: an interface clampretaining a portion of the interface material between the lower lid andthe interface clamp.
 113. The apparatus of claim 112, furthercomprising: an annular seal sealingly engaging a portion of the objectand a portion of the lid assembly.
 114. The apparatus of claim 111,wherein the lower lid includes a plurality of apertures therein. 115.The apparatus of claim 111, further comprising: a chamber located belowthe lower lid.
 116. The apparatus of claim 111, further comprising: aplurality of fasteners retaining the upper lid to the middle lid. 117.The apparatus of claim 115, further comprising: a plurality of fastenersretaining the lower lid to the chamber.
 118. The apparatus of claim 112,further comprising: a plurality of fasteners retaining the interfaceclamp to the middle lid.
 119. The apparatus of claim 111, wherein theupper lid comprises a generally cylindrical annular member having anupper surface, inner diameter surface, lower surface, outer diametersurface, and a plurality of apertures extending from the upper surfaceto the lower surface.
 120. The apparatus of claim 111, wherein the lowerlid comprises a generally cylindrical annular member having an uppersurface, first vertical inner cylindrical surface, inner annularsurface, cylindrical surface, bottom surface, outer cylindrical surface,and a plurality of apertures for receiving portions of fastenerstherein.
 121. The apparatus of claim 111, wherein the middle lidcomprises a generally cylindrical annular member having an uppersurface, frusto-conical annular inner surface, inner cylindricalsurface, first cylindrical annular surface, first vertical outerdiameter surface, second cylindrical annular surface, second verticalouter diameter surface, at least one aperture for supplying a gastherethrough, and at least one annular seal for sealingly engaging aportion of the object, the middle lid located between the upper lid andthe lower lid.
 122. The apparatus of claim 111, further comprising: aninterface clamp connected to the middle lid retaining a portion of theinterface material between the lower lid and the interface clamp. 123.The apparatus of claim 111, wherein the middle lid comprises a generallycylindrical annular member having an upper surface, frusto-conicalannular inner surface, inner cylindrical surface, first cylindricalannular surface, first vertical outer diameter surface, secondcylindrical annular surface, second vertical outer diameter surface, atleast one aperture for supplying a gas therethrough, and at least oneannular seal for sealing engaging a portion of the object, the middlelid located between the upper lid and the lower lid.
 124. The apparatusof claim 123, further comprising: an interface clamp connected to themiddle lid retaining a portion of the interface material between thelower lid and the interface clamp.
 125. The apparatus of claim 124,wherein the inner cylindrical surface of the middle lid includes anannular cylindrical lip having a plurality of radially extending groovestherein.
 126. The apparatus of claim 111, wherein the middle lidcomprises a generally cylindrical annular member having a first uppersurface, vertical cylindrical surface, second upper surface, first innerdiameter vertical surface, annular cylindrical surface, second innerdiameter vertical surface, lower surface, outer diameter surface, atleast one aperture for supplying a gas therethrough, and at least oneannular seal for sealing engaging a portion of the object, the middlelid located between the upper lid and the lower lid.
 127. The apparatusof claim 126, further comprising: an interface clamp connected to themiddle lid retaining a portion of the interface material between thelower lid and the interface clamp.
 128. The apparatus of claim 111,further comprising: a lid clamp located between the upper lid and themiddle lid.
 129. The apparatus of claim 111, further comprising: anobject clamp located between the upper lid and the middle lid; and a lidclamp located between the upper lid and the middle lid, the lid claimfurther located outside the object clamp.
 130. An apparatus for theplanarization of a surface on wafer, said apparatus comprising: an upperlid; a middle lid; an object having an upper surface, lower surface, andouter diameter, the object located below the upper lid; an interfacematerial located below the lower surface of the object, the interfacematerial retained in a position; and a lower lid having a portionthereof located below the lower surface of the object.
 131. Theapparatus of claim 130, further comprising: an interface clamp retaininga portion of the interface material between the middle lid and theinterface clamp.
 132. The apparatus of claim 130, further comprising: anannular seal located on the middle lid sealingly engaging a portion ofthe object.
 133. The apparatus of claim 130, wherein the lower lidincludes a plurality of apertures therein.
 134. The apparatus of claim130, wherein the middle lid includes an annular seal sealingly engaginga portion of the object.
 135. The apparatus of claim 130, furthercomprising: a chamber located below the lower lid.
 136. The apparatus ofclaim 130, further comprising: a plurality of fasteners retaining theupper lid to the middle lid.
 137. The apparatus of claim 135, furthercomprising: a plurality of fasteners retaining the lower lid to thechamber.
 138. The apparatus of claim 131, further comprising: aplurality of fasteners retaining the interface clamp to the middle lid.139. The apparatus of claim 130, further comprising: an object clamplocated between the upper lid and the middle; and a lid clamp locatedbetween the upper lid and the middle lid.
 140. The apparatus of claim130, wherein the upper lid comprises a generally cylindrical annularmember having an upper surface, inner diameter surface, lower surface,outer diameter surface, and a plurality of apertures extending from theupper surface to the lower surface.
 141. The apparatus of claim 130,wherein the lower lid comprises a generally cylindrical annular memberhaving an upper surface, first vertical inner cylindrical surface, innerannular surface, cylindrical surface, bottom surface, outer cylindricalsurface, and a plurality of apertures for receiving portions offasteners therein.
 142. The apparatus of claim 130, wherein the middlelid comprises a generally cylindrical annular member having an uppersurface, frusto-conical annular inner surface, inner cylindricalsurface, first cylindrical annular surface, first vertical outerdiameter surface, second cylindrical annular surface, second verticalouter diameter surface, at least one aperture for supplying a gastherethrough, and at least one annular seal for sealingly engaging aportion of the object, the middle lid located between the upper lid andthe lower lid.
 143. The apparatus of claim 142, further comprising: aninterface clamp connected to the middle lid retaining a portion of theinterface material between the lower lid and the interface clamp. 144.The apparatus of claim 130, wherein the middle lid comprises a generallycylindrical annular member having an upper surface, frusto-conicalannular inner surface, inner cylindrical surface, first cylindricalannular surface, first vertical outer diameter surface, secondcylindrical annular surface, second vertical outer diameter surface, atleast one aperture for supplying a gas therethrough, and at least oneannular seal for sealing engaging a portion of the object, the middlelid located between the upper lid and the lower lid.
 145. The apparatusof claim 130, further comprising: an interface clamp connected to themiddle lid retaining a portion of the interface material between thelower lid and the interface clamp.
 146. The apparatus of claim 144,wherein the inner cylindrical surface of the middle lid includes anannular cylindrical lip having a plurality of radially extending groovestherein.
 147. The apparatus of claim 130, wherein the middle lidcomprises a generally cylindrical annular member having a first uppersurface, vertical cylindrical surface, second upper surface, first innerdiameter vertical surface, annular cylindrical surface, second innerdiameter vertical surface, lower surface, outer diameter surface, atleast one aperture for supplying a gas therethrough, and at least oneannular seal for sealing engaging a portion of the object, the middlelid located between the upper lid and the lower lid.
 148. An apparatusfor the planarization of a surface on wafer, said apparatus comprising:a lid assembly including: an upper lid; a middle lid; an object havingan upper surface, lower surface, and outer diameter, the object having aportion thereof located below the upper lid; an interface materialretained below the lower surface of the object; a lower lid locatedbelow the middle lid; and a chamber located below the lid assembly, thechamber including: a platform located in the chamber.
 149. The apparatusof claim 148, further comprising: a resilient member located on theplatform in the chamber.
 150. The apparatus of claim 148, furthercomprising: an interface clamp retaining a portion of the interfacematerial between the middle lid and the interface clamp.
 151. Theapparatus of claim 148, further comprising: an annular seal located on aportion of the middle lid sealingly engaging a portion of the object.152. The apparatus of claim 148, wherein the lower lid includes aplurality of apertures therein.
 153. The apparatus of claim 148, furthercomprising: a plurality of fasteners retaining the upper lid to themiddle lid.
 154. The apparatus of claim 148, further comprising: aplurality of fasteners retaining the lower lid to the chamber lid. 155.The apparatus of claim 148, further comprising: a plurality of fastenersretaining the interface clamp to the lower lid.
 156. The apparatus ofclaim 148, wherein the upper lid comprises a generally cylindricalannular member having an upper surface, inner diameter surface, lowersurface, outer diameter surface, and a plurality of apertures extendingfrom the upper surface to the lower surface.
 157. The apparatus of claim148, wherein the lower lid comprises a generally cylindrical annularmember having an upper surface, first vertical inner cylindricalsurface, inner annular surface, cylindrical surface, bottom surface,outer cylindrical surface, and a plurality of apertures for receivingportions of fasteners therein.
 158. The apparatus of claim 148, whereinthe middle lid comprises a generally cylindrical annular member havingan upper surface, frusto-conical annular inner surface, innercylindrical surface, first cylindrical annular surface, first verticalouter diameter surface, second cylindrical annular surface, secondvertical outer diameter surface, at least one aperture for supplying agas therethrough, and at least one annular seal for sealingly engaging aportion of the object, the middle lid located between the upper lid andthe lower lid.
 159. The apparatus of claim 158, further comprising: aninterface clamp connected to the middle lid retaining a portion of theinterface material between the lower lid and the interface clamp. 160.The apparatus of claim 148, wherein the middle lid comprises a generallycylindrical annular member having an upper surface, frusto-conicalannular inner surface, inner cylindrical surface, first cylindricalannular surface, first vertical outer diameter surface, secondcylindrical annular surface, second vertical outer diameter surface, atleast one aperture for supplying a gas therethrough, and at least oneannular seal for sealing engaging a portion of the object, the middlelid located between the upper lid and the lower lid.
 161. The apparatusof claim 160, further comprising: an interface clamp connected to themiddle lid retaining a portion of the interface material between thelower lid and the interface clamp.
 162. The apparatus of claim 160,wherein the inner cylindrical surface of the middle lid includes anannular cylindrical lip having a plurality of radially extending groovestherein.
 163. The apparatus of claim 148, wherein the middle lidcomprises a generally cylindrical annular member having a first uppersurface, vertical cylindrical surface, second upper surface, first innerdiameter vertical surface, annular cylindrical surface, second innerdiameter vertical surface, lower surface, outer diameter surface, atleast one aperture for supplying a gas therethrough, and at least oneannular seal for sealing engaging a portion of the object, the middlelid located between the upper lid and the lower lid.
 164. The apparatusof claim 163, further comprising: an interface clamp connected to themiddle lid retaining a portion of the interface material between thelower lid and the interface clamp.
 165. The apparatus of claim 148,further comprising: an object clamp located between the upper lid andthe middle lid.
 166. The apparatus of claim 148, further comprising: alid clamp located between the upper lid and the middle lid.
 167. Theapparatus of claim 148, further comprising: an object clamp locatedbetween the upper lid and the middle lid; and a lid clamp locatedbetween the upper lid and the middle lid, the lid claim further locatedoutside the object clamp.
 168. An apparatus for the planarization of asurface on wafer, said apparatus comprising: an upper lid including anupper surface, inner diameter surface, lower surface, an outer diametersurface, and a plurality of apertures extending from the upper surfaceto the lower surface; a lid clamp including an upper surface, innerdiameter surface, lower surface, outer diameter surface, and a pluralityof apertures extending from the upper surface to the lower surface, thelid clamp located below the upper lid; a middle lid including agenerally cylindrical annular member having an upper surface,frusto-conical annular inner surface, inner cylindrical surface, firstvertical outer diameter surface first cylindrical annular surface havinga plurality of threaded blind apertures therein, second cylindricalannular surface, second vertical outer diameter surface, at least oneaperture for supplying a gas therethrough, a plurality of threadedapertures, and at least one annular seal for sealingly engaging aportion of the object, the middle lid located between the upper lid andthe lower lid; an object including a generally cylindrical annularmember having an upper surface, lower surface, and outer diameter havingportions thereof sealingly engaging the annular seal in the firstvertical inner diameter surface of the middle lid and the annular sealin the inner annular surface of the middle lid, the object located belowthe upper lid and in the middle lid; an object clamp including agenerally cylindrical annular member having an upper surface, innerdiameter vertical surface, frusto-conical annular surface, lower surfaceand outer diameter surface; an annular seal having a portion thereofabutting the object clamp and the middle lid; an interface materialretained below the lower surface of the object; a lower lid having aportion thereof located below the lower surface of the object, the lowerlid including an upper surface having an annular seal groove thereinhaving an annular seal therein sealingly engaging the second cylindricalannular surface of the middle lid, a first vertical inner diametersurface, first vertical inner cylindrical inner surface, inner annularsurface having a plurality of blind apertures therein, second verticalinner cylindrical surface, a bottom surface having an annular sealgroove therein having an annular seal therein, an outer diametersurface, outer diameter cylindrical surface, and a plurality ofapertures extending from the upper surface to the bottom surface; aninterface clamp including a generally cylindrical annular member havingan upper surface, inner cylindrical surface, lower surface, outercylindrical, and a plurality of threaded apertures extending from theupper surface to the lower surface; an annular seal located between theupper lid and the lid clamp and the object clamp; an annular seallocated between the lid clamp and the middle lid; a plurality ofthreaded fasteners, each threaded fastener of said plurality of threadedfasteners extending through the upper lid, extending through the lidclamp, and engaging a portion of a threaded aperture of the plurality ofthreaded apertures of the middle lid thereinto; and a plurality ofthreaded fasteners, each threaded fastener of said plurality of threadedfasteners extending through the interface clamp and engaging a portionof a threaded aperture of the plurality of threaded apertures extendingfrom the first cylindrical annular surface of the middle lid thereinto.169. An apparatus for the planarization of a surface on wafer, saidapparatus comprising: an upper lid including a generally cylindricalannular member having an upper surface, inner diameter surface, lowersurface, an outer diameter surface, and a plurality of aperturesextending from the upper surface to the lower surface; a lid clampincluding a generally cylindrical annular member having an uppersurface, inner cylindrical surface, lower surface, outer cylindricalsurface, and a plurality of apertures extending therethrough; a middlelid including a generally cylindrical annular member having an uppersurface, frusto-conical annular inner surface, inner cylindricalsurface, annular cylindrical lip having a plurality of radiallyextending grooves therein, first cylindrical annular surface having aplurality of threaded blind apertures therein, first vertical outerdiameter surface, second cylindrical annular surface, second verticalouter diameter surface, at least one apertures extending from the secondvertical outer diameter surface to the inner cylindrical surface for theflow of fluid therethrough, and a plurality of threaded apertures; alower lid including a generally cylindrical annular member having aportion thereof located below the lower surface of the object, the lowerlid including an upper surface having an annular groove therein havingan annular seal therein, a first vertical inner cylindrical surface,inner annular surface having a plurality of blind apertures therein,second vertical inner cylindrical surface, bottom surface having annularseal groove therein having an annular seal therein, outer diametercylindrical surface, and a plurality of apertures extending therethroughfrom the upper surface to the bottom surface; an interface clampincluding a generally cylindrical annular member having an uppersurface, inner cylindrical surface, lower surface, outer diametersurface, and a plurality of apertures extending therethrough; an objecthaving an upper surface, lower surface, and outer diameter havingportions thereof sealingly engaging the annular seal located in thelower lid, the object located below the upper lid and in the middle lid;an interface material retained below the lower surface of the object; anobject clamp including a generally cylindrical annular member having anupper surface, first vertical inner diameter surface, inner diametervertical surface, frusto-conical annular surface, lower surface, outerdiameter surface, and a plurality of apertures extending from the uppersurface to the lower surface; an annular seal located between the upperlid and the lid clamp and the object clamp; an annular seal locatedbetween the lid clamp and the middle lid; a plurality of threadedfasteners, each threaded fastener extending through the upper lid andengaging a portion of an aperture of the plurality of threaded aperturesextending from the upper surface of the middle lid to the secondcylindrical annular surface thereof; and a plurality of threadedfasteners, each thread fastener extending through an aperture of theplurality of apertures in the interface clamp and engaging a portion ofa blind threaded aperture of the plurality of blind threaded aperturesextending from the first cylindrical annular surface of the middle lidthereinto.
 170. An apparatus for the planarization of a surface onwafer, said apparatus comprising: an upper lid including a generallycylindrical annular member having an upper surface, inner diametersurface, lower surface, an outer diameter surface, and a plurality ofapertures extending from the upper surface to the lower surface; a lidclamp including a generally cylindrical annular member having an uppersurface, inner cylindrical surface, lower surface, outer cylindricalsurface, and a plurality of apertures extending from the upper surfaceto the lower surface, the lid clamp located below the upper lid; amiddle lid including a generally cylindrical annular member having anupper surface, vertical cylindrical surface, second upper surface, firstinner diameter vertical surface having annular groove therein having anannular seal therein, annular cylindrical surface having annular groovetherein having an annular seal therein, second inner diameter verticalsurface, lower surface, outer diameter surface, at least one apertureextending from the outer diameter surface to the second inner diametervertical surface for the supply of fluid therethrough, and a pluralityof threaded apertures extending from the lower surface, and a pluralityof threaded apertures extending from the first upper surface; a lowerlid including a generally cylindrical annular member having an uppersurface having an annular seal groove therein having an annular sealtherein, first vertical inner cylindrical surface, inner annular surfacehaving a plurality of blind apertures therein, second vertical innercylindrical surface, lower surface having annular seal groove thereinhaving an annular seal therein, outer diameter cylindrical surface, aplurality of apertures extending from the upper surface to the lowersurface; an interface clamp including a generally cylindrical annularmember having an upper surface, inner diameter, lower surface, an innerannular extending lip, and a plurality of apertures; an object having anupper surface, lower surface, and outer diameter having portions thereofsealingly engaging the annular seal in the middle lid, the objectlocated below the upper lid and in the middle lid; an interface materialretained below the lower surface of the object; an annular seal locatedbetween the upper lid and the lid clamp and the middle lid; an annularseal located between the lid clamp and the middle lid; a plurality ofthreaded fasteners, each threaded fastener extending through the upperlid, extending through the lid clamp, and engaging a portion of a blindthreaded aperture of the plurality of blind threaded apertures extendingfrom the first upper surface of the middle lid thereinto; and aplurality of threaded fasteners, each threaded fastener extendingthrough the interface clamp and engaging a portion of a blind threadedaperture of the plurality of blind threaded apertures extending from thelower surface of the middle lid thereinto.
 171. An apparatus for theplanarization of a surface on wafer, said apparatus comprising: an upperlid including a generally cylindrical annular member having an uppersurface, inner diameter surface, lower surface, an outer diametersurface, and a plurality of apertures extending from the upper surfaceto the lower surface; a lid clamp including a generally cylindricalannular member having an upper surface, inner cylindrical surface, lowersurface, outer cylindrical surface, and a plurality of aperturesextending therethrough; a middle lid including a generally cylindricalannular member having an upper surface, frusto-conical annular innersurface, inner cylindrical surface, first lower surface, first verticalouter diameter, second lower surface, outer diameter, and a plurality ofapertures extending from the upper surface to the second lower surface;a lower lid including a generally cylindrical annular member having afirst upper surface having an annular seal groove therein having anannular seal therein, first vertical inner cylindrical surface, innerannular surface, second vertical cylindrical inner diameter, bottomsurface having annular seal groove therein having an annular sealtherein, outer diameter cylindrical surface, and a plurality ofapertures extending from the first upper surface to the lower surface;an object clamp including a generally cylindrical annular member havingan upper surface, inner diameter vertical surface, frusto-conicalannular surface, lower surface, and outer diameter surface; an objecthaving an upper surface, lower surface, and outer diameter havingportions thereof sealingly engaging the annular seals in the middle lid,the object located below the upper lid and in the middle lid; aninterface material retained below the lower surface of the object andbelow the lower surface of the lower lid; an annular seal locatedbetween the upper lid and the lid clamp and the object clamp; an annularseal located between the lid clamp and the middle lid; and a pluralityof threaded fasteners, each threaded fastener extending through theupper lid and engaging a portion of a threaded aperture of the pluralityof blind threaded apertures extending from the upper surface of themiddle lid thereinto.
 172. An apparatus for the planarization of asurface on wafer, said apparatus comprising: a lid assembly comprising:an upper lid including a generally cylindrical annular member having anupper surface, inner diameter surface, lower surface, an outer diametersurface, and a plurality of apertures extending from the upper surfaceto the lower surface; a lid clamp including a generally cylindricalannular member having an upper surface, inner diameter surface, lowersurface, outer diameter surface, and a plurality of apertures extendingfrom the upper surface to the lower surface, the lid clamp located belowthe upper lid; a middle lid including a generally cylindrical annularmember having an upper surface, frusto-conical annular inner surface,inner cylindrical surface, first vertical outer diameter surface firstcylindrical annular surface having a plurality of threaded blindapertures therein, second cylindrical annular surface, second verticalouter diameter surface, at least one aperture for supplying a gastherethrough, a plurality of threaded apertures, and at least oneannular seal for sealingly engaging a portion of the object, the middlelid located between the upper lid and the lower lid; an object having anupper surface, lower surface, and outer diameter having portions thereofsealingly engaging the annular seal in the first vertical inner diametersurface of the middle lid and the annular seal in the inner annularsurface of the middle lid, the object located below the upper lid and inthe middle lid; an object clamp including a generally cylindricalannular member having an upper surface, inner diameter vertical surface,frusto-conical annular surface, lower surface and outer diametersurface; an annular seal having a portion thereof abutting the objectclamp and the middle lid; an interface material retained below the lowersurface of the object; a lower lid having a portion thereof locatedbelow the lower surface of the object, the lower lid including agenerally cylindrical annular member having an upper surface having anannular seal groove therein having an annular seal therein sealinglyengaging the second cylindrical annular surface of the middle lid, afirst vertical inner diameter surface, first vertical inner cylindricalinner surface, inner annular surface having a plurality of blindapertures therein, second vertical inner cylindrical surface, a bottomsurface having an annular seal groove therein having an annular sealtherein, an outer diameter surface, outer diameter cylindrical surface,and a plurality of apertures extending from the upper surface to thebottom surface; an interface clamp including a generally cylindricalannular member having an upper surface, inner cylindrical surface, lowersurface, outer cylindrical, and a plurality of threaded aperturesextending from the upper surface to the lower surface; an annular seallocated between the upper lid and the lid clamp and the object clamp; anannular seal located between the lid clamp and the middle lid; aplurality of threaded fasteners, each threaded fastener of saidplurality of threaded fasteners extending through the upper lid,extending through the lid clamp, and engaging a portion of a threadedaperture of the plurality of threaded apertures of the middle lidthereinto; and a plurality of threaded fasteners, each threaded fastenerof said plurality of threaded fasteners extending through the interfaceclamp and engaging a portion of a threaded aperture of the plurality ofthreaded apertures extending from the first cylindrical annular surfaceof the middle lid thereinto; and a chamber located below the lidassembly, the chamber including: a platform located in the chamber. 173.The apparatus of claim 172, further comprising: a resilient memberlocated on the platform.
 174. The apparatus of claim 172, furthercomprising: a thermocouple for measuring the temperature in the chamber.175. An apparatus for the planarization of a surface on wafer, saidapparatus comprising: a lid assembly comprising: an upper lid includinga generally cylindrica annular member having an upper surface, innerdiameter surface, lower surface, an outer diameter surface, and aplurality of apertures extending from the upper surface to the lowersurface; a lid clamp including a generally cylindrica annular memberhaving an upper surface, inner cylindrical surface, lower surface, outercylindrical surface, and a plurality of apertures extendingtherethrough; a middle lid including a generally cylindrical annularmember having an upper surface, frusto-conical annular inner surface,inner cylindrical surface, annular cylindrical lip having a plurality ofradially extending grooves therein, first cylindrical annular surfacehaving a plurality of threaded blind apertures therein, first verticalouter diameter surface, second cylindrical annular surface, secondvertical outer diameter surface, at least one apertures extending fromthe second vertical outer diameter surface to the inner cylindricalsurface for the flow of fluid therethrough, and a plurality of threadedapertures; a lower lid including a generally cylindrical annular memberhaving an upper surface having an annular groove therein having anannular seal therein, a first vertical inner cylindrical surface, innerannular surface having a plurality of blind apertures therein, secondvertical inner cylindrical surface, bottom surface having annular sealgroove therein having an annular seal therein, outer diametercylindrical surface, and a plurality of apertures extending therethroughfrom the upper surface to the bottom surface; an interface clampincluding a generally cylindrical annular member having an uppersurface, inner cylindrical surface, lower surface, outer diametersurface, and a plurality of apertures extending therethrough; an objecthaving an upper surface, lower surface, and outer diameter havingportions thereof sealingly engaging the annular seal located in thelower lid, the object located below the upper lid and in the middle lid;an interface material retained below the lower surface of the object; anobject clamp including a generally cylindrical annular member having anupper surface, first vertical inner diameter surface, inner diametervertical surface, frusto-conical annular surface, lower surface, outerdiameter surface, and a plurality of apertures extending from the uppersurface to the lower surface; an annular seal located between the upperlid and the lid clamp and the object clamp; an annular seal locatedbetween the lid clamp and the middle lid; a plurality of threadedfasteners, each threaded fastener extending through the upper lid andengaging a portion of a aperture of the plurality of threaded aperturesextending from the upper surface of the middle lid to the secondcylindrical annular surface thereof; and a plurality of threadedfasteners, each thread fastener extending through an aperture of theplurality of apertures in the interface clamp and engaging a portion ofa blind threaded aperture of the plurality of blind threaded aperturesextending from the first cylindrical annular surface of the middle lidthereinto; and a chamber located below the lid assembly, the chamberincluding: a platform located in the chamber.
 176. The apparatus ofclaim 175, further comprising: a resilient member located on theplatform.
 177. The apparatus of claim 175, further comprising: athermocouple for measuring the temperature in the chamber.
 178. Anapparatus for the planarization of a surface on wafer, said apparatuscomprising: a lid assembly comprising: an upper lid including agenerally cylindrical annular member having an upper surface, innerdiameter surface, lower surface, an outer diameter surface, and aplurality of apertures extending from the upper surface to the lowersurface; a lid clamp including a generally cylindrical annular memberhaving an upper surface, inner cylindrical surface, lower surface, outercylindrical surface, and a plurality of apertures extending from theupper surface to the lower surface, the lid clamp located below theupper lid; a middle lid including a generally cylindrical annular memberhaving an upper surface, vertical cylindrical surface, second uppersurface, first inner diameter vertical surface having annular groovetherein having an annular seal therein, annular cylindrical surfacehaving annular groove therein having an annular seal therein, secondinner diameter vertical surface, lower surface, outer diameter surface,at least one aperture extending from the outer diameter surface to thesecond inner diameter vertical surface for the supply of fluidtherethrough, and a plurality of threaded apertures extending from thelower surface, and a plurality of threaded apertures extending from thefirst upper surface; a lower lid including a generally cylindricalannular member having an upper surface having an annular seal groovetherein having an annular seal therein, first vertical inner cylindricalsurface, inner annular surface having a plurality of blind aperturestherein, second vertical inner cylindrical surface, lower surface havingannular seal groove therein having an annular seal therein, outerdiameter cylindrical surface, a plurality of apertures extending fromthe upper surface to the lower surface; an interface clamp including agenerally cylindrical annular member having an upper surface, innerdiameters, lower surface, an inner annular extending lip, and aplurality of apertures; an object having an upper surface, lowersurface, and outer diameter having portions thereof sealingly engagingthe annular seal in the middle lid, the object located below the upperlid and in the middle lid; an interface material retained below thelower surface of the object; an annular seal located between the upperlid and the lid clamp and the middle clamp; an annular seal locatedbetween the lid clamp and the middle lid; a plurality of threadedfasteners, each threaded fastener extending through the upper lid,extending through the lid clamp, and engaging a portion of a blindthreaded aperture of the plurality of blind threaded apertures extendingfrom the first upper surface of the middle lid thereinto; and aplurality of threaded fasteners, each threaded fastener extendingthrough the interface clamp and engaging a portion of a blind threadedaperture of the plurality of blind threaded apertures extending from thelower surface of the middle lid thereinto; and a chamber located belowthe lid assembly, the chamber including: a platform located in thechamber.
 179. The apparatus of claim 178, further comprising: aresilient member located on the platform.
 180. The apparatus of claim178, further comprising: a thermocouple for measuring the temperature inthe chamber.
 181. An apparatus for the planarization of a surface onwafer, said apparatus comprising: a lid assembly comprising: an upperlid including a generally cylindrical annular member having an uppersurface, inner diameter surface, lower surface, an outer diametersurface, and a plurality of apertures extending from the upper surfaceto the lower surface; a lid clamp including a generally cylindricalannular member having an upper surface, inner cylindrical surface, lowersurface, outer cylindrical surface, and a plurality of aperturesextending therethrough; a middle lid including a generally cylindricalannular member having an upper surface, frusto-conical annular innersurface, inner cylindrical surface, first lower surface, first verticalouter diameter, second lower surface, outer diameter, and a plurality ofapertures extending from the upper surface to the second lower surface;a lower lid including a generally cylindrical annular member having afirst upper surface having an annular seal groove therein having anannular seal therein, first vertical inner cylindrical surface, innerannular surface, second vertical cylindrical inner diameter, bottomsurface having annular seal groove therein having an annular sealtherein, outer diameter cylindrical surface, and a plurality ofapertures extending from the first upper surface to the lower surface;an object clamp including a generally cylindrical annular member havingan upper surface, inner diameter vertical surface, frusto-conicalannular surface, lower surface, and outer diameter surface; an objecthaving an upper surface, lower surface, and outer diameter havingportions thereof sealingly engaging the annular seals in the middle lid,the object located below the upper lid and in the middle lid; aninterface material retained below the lower surface of the object andbelow the lower surface of the lower lid; an annular seal locatedbetween the upper lid and the lid clamp and the object clamp; an annularseal located between the lid clamp and the middle lid; and a pluralityof threaded fasteners, each threaded fastener extending through theupper lid and engaging a portion of a threaded aperture of the pluralityof blind threaded apertures extending from the upper surface of themiddle lid thereinto; and a chamber located below the lid assembly, thechamber including: a platform located in the chamber.
 182. The apparatusof claim 181, further comprising: a resilient member located on theplatform.
 183. The apparatus of claim 181, further comprising: athermocouple for measuring the temperature in the chamber.